category: Videos

category: Auto, Security & Edge AI

Issues In Ramping Advanced Packaging
By Ed Sperling - 05 Aug, 2025 - Comments: 0

Multi-die assemblies require significantly more test data than a monolithic chip. Thermal mismatch between different layers can cause warping, which puts stress on the bonds that connect those layers, resulting in failures during testing. The big problem is that traditional daisy-chained test approaches cannot pinpoint where problems are occurring. Instead, they provide a go/no-go for the entir... » read more

Changes In Scan Test Data
By Ed Sperling - 29 Jul, 2025 - Comments: 0

Bigger designs with hundred of cores are creating an explosion in the volume of scan test data, significantly bumping up the amount of time spent on test. That raises the cost of test, forcing chipmakers to trade off higher costs with reliability. The solution is to raise the level of abstraction for scan tests, using a bus and packetized data that can run at much higher frequencies than is pos... » read more

Accelerating IP Reuse
By Ed Sperling - 23 Jul, 2025 - Comments: 0

Semiconductors are no longer monolithic designs developed by a single company. There is more third-party IP from different sources — as many as 1,000 different IPs in a complex SoC — and all of that needs to be integrated and work as one system, something that can require a lot of effort and time. Insaf Meliane, product management and marketing director at Arteris, talks about how the new v... » read more

AI In The IC Equipment Ecosystem
By Ed Sperling - 21 Jul, 2025 - Comments: 0

AI is playing an increasingly critical role in improving semiconductor equipment and processes, which are necessary as the industry moves to advanced manufacturing processes. This requires more steps, tighter integration and analysis of those various steps, and better optimization of tools. David Fried, corporate vice president at Lam Research, talks about how to accelerate the development of A... » read more

Silent Data Corruption
By Ed Sperling - 16 Jul, 2025 - Comments: 0

Everyone expects their compute systems to generate the correct answer. When they don't, it's cause for alarm, because it's not always clear how long the problem has persisted. Even worse, chips and systems are now so complex that it may require a unique sequence of operations to trigger a silent data error, and they may show up only occasionally, and maybe only after months or years of use in t... » read more

Rethinking Scan Chains In Semiconductor Test
By Ed Sperling - 02 Jul, 2025 - Comments: 0

An explosion in design complexity, fueled by increased transistor density and fundamental shifts in chip architectures, are beginning to overwhelm traditional approaches to test. Defects can show up in the clock trees that drive scan chains, and even inside blocks of scan cells, which may number in the millions. Jayant D'Souza, technical product director for yield learning products in Siemens E... » read more

LLMs On The Edge
By Ed Sperling - 16 Jun, 2025 - Comments: 0

Nearly all the data input for AI so far has been text, but that's about to change. In the future, that input likely will include video, voice, as well as other types of data, causing a massive increase in the amount of data that needs to be modeled and the compute resources necessary to make it all work. This is hard enough in hyperscale data centers, which are sprouting up everywhere to handle... » read more

Agentic AI In Chip Design
By Ann Mutschler - 11 Jun, 2025 - Comments: 1

Large language models (LLMs) like ChatGPT are just the starting point for generating content with AI. The next phase will be about harnessing LLMs with agents, providing automated feedback and improvements in performance and accuracy. Mehir Arora, backend engineer at ChipAgents, talks about the impact this can have on EDA and chip design, allowing smaller teams to compete with larger teams, and... » read more

Big Changes In Medical Electronics
By Ed Sperling - 09 Jun, 2025 - Comments: 0

Medical devices are becoming more capable, more complicated, and more deployable in the field rather than in a hospital or a doctor's office. But getting these purpose-built devices into the hands of consumers requires a whole bunch of new challenges, from safeguarding fragile on-board chemistries that can be destroyed by existing chip manufacturing and packaging processes to ensuring the mater... » read more

Optical Interconnectivity At 224 Gbps
By Ed Sperling - 28 May, 2025 - Comments: 0

AI is generating so much traffic that traditional copper-based approaches for moving data inside a chip, between chips, and between systems, are running out of steam. Just adding more channels is no longer viable. It requires more power to drive signals, and the distance those signals can travel without excessive loss is shrinking. Mike Klempa, product marketing specialist at Alphawave Semi, di... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy