From package-defined antennas to antenna-defined packages, and lots of tradeoffs in between.
Millimeter wave frequencies are essential for transferring more data more quickly, but they also require different packaging technology to minimize loss and drift. That opens up a number of tradeoffs around antenna in package, antenna on package, flexible circuits, and different substrates. Curtis Zwenger, vice president of R&D at Amkor Technology, talks about a host of new challenges ranging from over-the-air testing and cross-talk to impedance matching.
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