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Chiplets And Heterogeneous Packaging Are Changing System Design And Analysis

Why new system-level design methodologies are required for the next generation of electronics.

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In the domain of electronic product design, solely relying on process shrink as the primary driver of product innovation and improved system performance is no longer a viable approach. The cost and complexity associated with advanced nodes has everyone looking for alternatives to the traditional monolithic system on chip (SoC). The path most are taking leads to the world of “More than Moore” and heterogenous integration. These heterogenous, multi-chiplet architectures provide a much lower cost alternative to the latest design nodes, while still providing a robust re-use model based on IP in the form of physically realized chiplets. The package design now sits in the center of the universe for the next generation of electronics.

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