Why changes in the ecosystem are making this a cost-effective solution for different end markets.
The chiplet movement is a reaction to the rapidly changing IC landscape and the current IC fabrication realities. Engineers are increasingly realizing that it makes little sense to integrate every IP block in a system on one piece of silicon if the fit is poor. There are many advantages with monolithic silicon integration, but those advantages are rapidly being outweighed by the economics of building advanced technology ICs. It is extremely expensive and time consuming to integrate, validate, and tapeout chips that can only be justified with high volume demand. More importantly, adding functionality or creating variations to support multiple end products increases die size and costs. Chiplets are becoming an alternative solution. Fortunately, the ecosystem for chiplets is quickly developing to provide companies a new tool to create highly optimized and cost effective solutions for their various end markets.
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Rising costs and gaps in equipment emerge as technology scales; new tools under development.
Experts at the Table, part 1: Shrinking features isn’t enough anymore. The big challenge now is how to achieve economies of scale and minimize complex integration issues.
Explosion of data is forcing significant changes in where processing is done.
New market opportunities and global competitiveness are limited by qualified people.
Researchers digging into ways around the von Neumann bottleneck.
The promise of advanced packaging is being able to integrate heterogeneous chips, but a lot of work is needed to make that happen.
Better algorithms and more data could bolster adoption, particularly at advanced nodes.
30 facilities planned, including 10/7nm processes, but trade war and economic factors could slow progress.
New architectures, packaging approaches gain ground as costs increase, but shrinking features continues to play a role.
Improvement still needed for uptime, defectivity, line edge roughness and process flows.
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