Why changes in the ecosystem are making this a cost-effective solution for different end markets.
The chiplet movement is a reaction to the rapidly changing IC landscape and the current IC fabrication realities. Engineers are increasingly realizing that it makes little sense to integrate every IP block in a system on one piece of silicon if the fit is poor. There are many advantages with monolithic silicon integration, but those advantages are rapidly being outweighed by the economics of building advanced technology ICs. It is extremely expensive and time consuming to integrate, validate, and tapeout chips that can only be justified with high volume demand. More importantly, adding functionality or creating variations to support multiple end products increases die size and costs. Chiplets are becoming an alternative solution. Fortunately, the ecosystem for chiplets is quickly developing to provide companies a new tool to create highly optimized and cost effective solutions for their various end markets.
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100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Increased transistor density and utilization are creating memory performance issues.
Lots of unknowns will persist for decades across multiple market segments.
FPGAs, CPUs, and equipment receive funding in China; 98 startups raise over $2 billion.
Suppliers are investing new 300mm capacity, but it’s probably not enough. And despite burgeoning 200mm demand, only Okmetic and new players in China are adding capacity.
100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
From low resistance vias to buried power rails, it takes multiple strategies to usher in 2nm chips.
Some of the less common considerations for assessing the suitability of a system for high-performance workloads.
Manufacturing 3D structures will require atomic-level control of what’s removed and what stays on a wafer.
Different interconnect standards and packaging options being readied for mass chiplet adoption.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Disaggregation and the wind-down of Moore’s Law have changed everything.
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