Designing 5G Chips


5G is the wireless technology of the future, and it’s coming fast. The technology boasts very high-speed data transfer rates, much lower latency than 4G LTE, and the ability to handle significantly higher densities of devices per cell site. In short, it is the best technology for the massive amount of data that will be generated by sensors in cars, IoT devices, and a growing list of next-g... » read more

The Week In Review: Design


Tools & IP Cadence unveiled its latest DSP for embedded vision and AI, Tensilica Vision Q6 DSP. The DSP is built on a 13-stage processor pipeline and new system architecture designed for use with large local memories, and achieves 1.5GHz peak frequency and 1GHz typical frequency at 16nm. Compared to its predecessor, it offers 1.5X greater vision and AI performance than its predecessor and ... » read more

High-Performance Memory Challenges


Designing memories for high-performance applications is becoming far more complex at 7/5nm. There are more factors to consider, more bottlenecks to contend with, and more tradeoffs required to solve them. One of the biggest challenges is the sheer volume of data that needs to be processed for AI, machine learning or deep learning, or even in classic data center server racks. “The design... » read more

New Market Drivers


Semiconductor Engineering sat down to discuss changing market dynamics with Steve Mensor, vice president of marketing for [getentity id="22926" e_name="Achronix"]; Apurva Kalia, vice president of R&D in the System and Verification group of [getentity id="22032" e_name="Cadence"]; Mohammed Kassem, CTO for [getentity id="22910" comment="efabless"]; Matthew Balance, product engineer and techno... » read more

eFPGAs Accelerate Data-Centric Processing


With the ever-increasing requirements to manage and process enterprise data, system architects are looking closer than ever at programmable logic, a technology to make computing much more efficient and secure. While traditional processors force data into their pipelines through a complex hierarchy of caches, programmable logic makes it possible to construct data pipelines. Data can flow seam... » read more

New Market Drivers


Semiconductor Engineering sat down to discuss changing market dynamics with Steve Mensor, vice president of marketing for [getentity id="22926" e_name="Achronix"]; Apurva Kalia, vice president of R&D in the System and Verification group of [getentity id="22032" e_name="Cadence"]; Mohamed Kassem, CTO for [getentity id="22910" comment="efabless"]; Matthew Balance, product engineer and technol... » read more

The Ideal Solution For AI Applications — Speedcore eFPGAs


AI requires a careful balance of datapath performance, memory latency, and throughput that requires an approach based on pulling as much of the functionality as possible into an ASIC or SoC. But that single-chip device needs plasticity to be able to handle the changes in structure that are inevitable in machine-learning projects. Adding eFPGA technology provides the mixture of flexibility and s... » read more

The Bumpy Road To 5G


5G is coming, but not everywhere, not all at once, and not the fastest version of this technology right away. In fact, the probable scenario is that 5G will be rolled out first in densely populated urban areas, starting in 2020 or 2021, with increasingly widespread adoption over the next decade after that. But 5G is unlikely to ever completely replace 4G LTE, just as a smart phone today roll... » read more

New Issues In Advanced Packaging


Advanced packaging is gaining in popularity as the cost and complexity of integrating everything onto a planar SoC becomes more difficult and costly at each new node, but ensuring that these packaged die function properly and yield sufficiently isn't so simple. There are a number of factors that are tilting more of the the semiconductor industry toward advanced [getkc id="27" kc_name="packag... » read more

The Week In Review: Design


Startup OnScale launched with advanced CAE multi-physics solvers that are seamlessly integrated with a scalable, high performance cloud computing platform built on Amazon's AWS. The company's model is built around a Solver-as-a-Service pay-as-you-go subscription model and targets 5G, IoT/Industrial IoT, biomedical, and autonomous car markets. The company has $3 million in strategic seed fund... » read more

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