A new technical paper titled “Using both faces of polar semiconductor wafers for functional devices” was published by researchers at Cornell University and Polish Academy of Sciences.
Find the technical paper here. Published September 2024.
Cornell University’s news release is here, stating “Cornell researchers, in collaboration with a team at the Polish Academy of Sciences, have developed the first dual-sided – or “dualtronic” – chip that combines its photonic and electronic functions simultaneously, an innovation that could shrink the size of functional devices, make them more energy efficient and reduce manufacturing costs.”
van Deurzen, L., Kim, E., Pieczulewski, N. et al. Using both faces of polar semiconductor wafers for functional devices. Nature (2024). https://doi.org/10.1038/s41586-024-07983-z.
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