Connected Cars: From Chip To City


As the automotive industry moves closer to autonomous vehicles, ecosystem players are focusing on the infrastructure pieces needed to make autonomous technology a reality for the first adopters, which are most likely commercial fleets. Vehicle-to-infrastructure (V2I or v2i) is a communications model that allows vehicles to share information with the components that support a country's hi... » read more

Manufacturing Bits: April 10


Higher power GaN Imec and Qromis have announced the development of a new gallium nitride (GaN) substrate technology that enables power devices at 650 volts and above. GaN is an emerging technology for power semiconductor applications. Based on a GaN-on-silicon technology, GaN-based power semis operate at 650 volts and above. In simple terms, the buffer layers between the GaN device and the ... » read more

Mixing 4G And 5G


5G networks will impact the number and types of ICs in end-user devices and the base stations used to transmit the signals (including the repeaters that rebroadcast those signals). And this is before we begin to consider the technology impact to the infrastructure required to support the data generated in a 5G ecosystem (servers, memory and so on). First, 5G is expected to transmit up to 10 ... » read more

LiDAR Goes Back To The Future


LiDAR is emerging as an increasingly important piece of the enabling technology in autonomous driving, along with advanced computer vision and radar sensor chips. But LiDAR systems also are finding their way into a variety of other applications, such as industrial automation, including robotics, and unmanned aerial vehicles. Advanced mapping is another rapidly growing market for LiDAR, which... » read more

Manufacturing Bits: Feb. 6


GaN trusted foundry HRL Laboratories--an R&D venture between Boeing and General Motors--has launched a new foundry service for use in advanced millimeter-wave (mmWave) gallium-nitride (GaN) technology applications. HRL’s process, called T3-GaN, is a high-electron-mobility transistor technology. It will enable the fabrication of GaN-based monolithic microwave integrated circuits (MMICs) fo... » read more

Power/Performance Bits: Nov 28


Deep learning to detect nuclear reactor cracks Inspecting nuclear power plant components for cracks is critical to preventing leaks, as well as to control in maintenance costs. But the current vision-based crack detection approaches are not very effective. Moreover, they are prone to human error, which in the case of nuclear power can be disastrous. To address this problem, Purdue Universit... » read more

Radar Versus LiDAR


Demand is picking up for vision, radar and LiDAR sensors that enable assisted and autonomous driving capabilities in cars, but carmakers are now pushing for some new and demanding requirements from suppliers. The automotive market always has been tough on suppliers. OEMs want smaller, faster and cheaper devices at the same or improved safety levels for both advanced driver-assistance systems... » read more

The 200mm Equipment Scramble


An explosion in 200mm demand has set off a frenzied search for used semiconductor manufacturing equipment that can be used at older process nodes. The problem is there is not enough used equipment available, and not all of the new or expanding 200mm fabs can afford to pay the premium for refurbished or new equipment. This may sound like a straightforward supply and demand issue, but behind t... » read more

Foundries Accelerate Auto Efforts


Foundries are ramping up their efforts in automotive chip production in preparation for a surge in semiconductors used in assisted and autonomous driving. All of the major foundry vendors are scrambling to assemble the pieces and expand their process portfolios for automotive customers. The foundries are seeing a growing demand from automotive IC customers amid the push toward advanced drive... » read more

Changing Direction In Chip Design


Andrzej Strojwas, chief technologist at PDF Solutions and professor of electrical and computer engineering at Carnegie Mellon University—and the winner of this year's Phil Kaufman Award for distinguished contributions to EDA—sat down with Semiconductor Engineering to talk about device scaling, why the semiconductor industry will begin to fragment around new architectures and packaging, and ... » read more

← Older posts