Overcoming the challenges of multi-die designs.
Despite the clear advantages of multi-die designs, there are numerous new challenges that stand in the way of multi-die design realization. This white paper focuses on those challenges that can be addressed by early architecture exploration of multi-die designs, including:
-System pathfinding
-Memory utilization and coherency
-Power/thermal management
Find out how to overcome such challenges with a standards-based performance and power analysis tool for early architecture exploration of multi-die designs. It accounts for the interdependencies between multiple dies (also referred to as chiplets) within multi-die systems.
Read more here.
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