GSA’s paper on chiplets explores the commercial, interface, packaging, and security issues that heterogenous chiplets face.
Chiplets are a hot topic in the semiconductor industry, and to many, represent a paradigm change for chip designers and chip consumers alike. While heterogenous chiplets seem to have multiple advantages over traditional monolithic silicon and even homogenous chiplets, they still have not been mass-market deployed. This white paper, published in cooperation with the Global Semiconductor Alliance, explores the commercial, interface, packaging, and security issues heterogenous chiplets face, along with recommendations for the industry’s successful deployment of heterogenous chiplets.
By Global Semiconductor Alliance Intellectual Property Interest Group, with Expedera’s Paul Karazuba as the editor.
Click here to read more.
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