The Darker Side Of Consolidation


Another wave of consolidation is underway in the semiconductor industry, setting the stage for some high-stakes competitive battles over market turf and sowing confusion across the supply chain about continued support throughout a product's projected lifetime. The consolidation comes as chipmakers already are grappling with rising complexity, the loss of a roadmap for future designs as Moore... » read more

IIoT Security Threat Rising


The rapid growth of the Industrial Internet of Things is raising questions about just how secure these systems are today, how to improve security, and who exactly should be responsible for that. These issues are interlaced with a shift in where a growing volume of data gets processed, the cost and speed of moving large amounts of data, and the increasing frequency and cost of attacks. "Di... » read more

Monetizing Semiconductors From Silicon To Services


In 2016, Rambus published a think piece titled “Charting a New Course for Semiconductors.” The paper explored a diverse range of challenges faced by the industry, including increasing development costs, shrinking margins, market saturation and accelerating M&A activity. These challenges have only become more pronounced in 2018, as the newly consolidated semiconductor industry actively seeks... » read more

Border Tax Shakeup


A border tax is the talk of the financial world. While this has clear implications for car manufacturers, where it's rather easy to tell where parts such an engine block or a braking system were manufactured, it's far less tangible when it comes to electronics in general, and semiconductors in particular. In a complex SoC, IP can be developed in more than one country, and multinational techn... » read more

CEO Outlook: Chip Design 2017


After two consecutive flat to slightly down years, the semiconductor industry is poised for growth in 2017. Cowan this month predicted 4.7% growth in semiconductor sales in 2017, while World Semiconductor Trade Statistics (WSTS) put that figure at 3.3%. And last month, International Business Strategies (IBS) pegged the number at 4.6%, according to statistics compiled by the Global Semiconduc... » read more

The Week In Review: Manufacturing


Intel announced that the company’s former CEO and chairman, Andrew Grove, passed away. He was 79. Present at Intel’s 1968 founding with Robert Noyce and Gordon Moore, Grove became Intel’s president in 1979 and CEO in 1987. He served as chairman from 1997 to 2005. “We are deeply saddened by the passing of former Intel Chairman and CEO Andy Grove,” said Intel CEO Brian Krzanich, in a st... » read more

Charting A New Course For Semiconductors


The semiconductor industry is at an inflection point facing challenges, including rising development costs, shrinking margins, market saturation and unprecedented consolidation. Although no stranger to boom and bust cycles, semiconductor companies are actively seeking a return to stability via a more sustainable and collaborative business paradigm. In this context, Rambus and the Global S... » read more

Don’t Forget To Consider Productivity In Semiconductor IP Evaluations


When companies consider purchasing Semiconductor IP (SIP), they often have a strict procedure for evaluating third-party vendors and their products. If they don’t have a set way of evaluating IP, the Global Semiconductor Alliance (GSA) has developed a Hard IP Licensing Risk Assessment Tool to aid in assessing the value of IP (there is also a quality assessment tool). This aid is part of the G... » read more

The Week In Review: Design/IoT


Tools Calypto rolled out its third-generation high-level synthesis platform after three years of development, adding granular control over which regions are optimized and the ability to work top-down and bottom-up—basically allowing designers to zoom in and out as needed. In addition, the tool has a 10X increase in capacity and supports SystemC and C++. eSilicon unveiled its online conf... » read more

New Product Introduction Process For Heterogeneous 2.5D Devices


For the past few years, the most popular topics in the 2.5D space have been: The design tools Foundry processes for through-silicon vias, temporary bonding and bump architecture The assembly process, such as what is first bonded to what The industry is at the point where the open variables on these topics are narrowing, and other critical aspects need to get far better attention. The... » read more

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