Overcoming the many multi-die design challenges and improve productivity with optimized performance and system power.
The semiconductor industry is experiencing a monumental shift in chip design, driven by the dramatic increase in AI compute performance requirements and limitations of Moore’s Law. The industry is adopting multi-die designs, which is the heterogeneous or homogeneous integration of dies (also called chiplets) in a single package.
While multi-die design is the solution, it also introduces several new challenges, including integration, power and thermal management, system pathfinding, connectivity, signoff and analysis, test and reliability, and memory utilization.
Read more here, including how to increase success from early architecture to manufacturing.
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