Safety, security and reliability have to outperform almost any other application in this market.
There is tremendous growth in the automotive IC market due to the trend towards electric or hybrid cars and applications for enhanced safety. However, the technical challenges of implementing today’s connected car and the autonomous vehicles of the future are daunting.
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100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Increased transistor density and utilization are creating memory performance issues.
FPGAs, CPUs, and equipment receive funding in China; 98 startups raise over $2 billion.
Heterogeneous designs and AI/ML processing expose the limitations of existing methodologies and tools.
Suppliers are investing new 300mm capacity, but it’s probably not enough. And despite burgeoning 200mm demand, only Okmetic and new players in China are adding capacity.
100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
From low resistance vias to buried power rails, it takes multiple strategies to usher in 2nm chips.
Some of the less common considerations for assessing the suitability of a system for high-performance workloads.
Manufacturing 3D structures will require atomic-level control of what’s removed and what stays on a wafer.
Different interconnect standards and packaging options being readied for mass chiplet adoption.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Increased transistor density and utilization are creating memory performance issues.
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