Application Driven Network-on Chip Architecture Exploration & Refinement for a Complex SoC


Peer-reviewed technical journal article from Springer's "Design Automation for Embedded Systems Journal."  Summarizes the various features a NoC is required to implement to be integrated in modern SoCs. Describes a top-down approach, based on the progressive refinement of the NoC description from its functional specification (Sect. 4) to its verification (Sect. 8) Click here to read more. ... » read more

Scramble For The White Space


Chipmakers are pushing to utilize more of the unused portion of a design for different functions, reducing margin in the rest of the chip to more clearly define that white space. White space typically is used to relieve back-end routing congestion before all of the silicon area is used up. But a significant amount of space still remain unused. That provides an opportunity for inserting monit... » read more

The Role Of NoCs In System-Level Services


The primary objective of any network-on-chip (NoC) interconnect is to move data around a chip as efficiently as possible with as little impact as possible on design closure while meeting or exceeding key design metrics (PPA, etc.). These networks have become the central nervous system of SoCs and are starting to play a larger role in system-level services like quality of service (QoS), debug, p... » read more

Designing For Extreme Low Power


There are several techniques available for low power design, but whenever a nanowatt or picojoule matters, all available methods must be used. Some of the necessary techniques are different from those used for high-end designs. Others have been lost over time because their impact was considered too small, or not worth the additional design effort. But for devices that last a lifetime on a si... » read more

An Automotive Value Chain In Flux


When companies view suppliers from inside their specialized niches, it is tempting to imagine the business world will continue as-is, with just minimal improvements each year. But in the automotive value chain, this no longer holds. The rapid pace of innovation around intelligent systems in cars is disrupting the business flow. Back in simpler times, semiconductor companies would work with Tier... » read more

Different Levels Of Interconnects


The interconnect hierarchy from metal 0 in a semiconductor all the way up to racks of servers. Kurt Shuler, vice president of marketing at Arteris IP, explains why each one is different, and how every level can contribute to latency and performance. » read more

Building Your Own NoC And The Hazards Of (Not) Changing


There is a perennial challenge that all R&D organizations face – how much of what we develop is essential to our competitive advantage and how much can be acquired at lower cost and risk rather than built from scratch? It’s easy to believe in the heat of battle that everything we are doing must be crucial. But the world continues to change around us. What was optional yesterday may be e... » read more

Week In Review: Auto, Security, Pervasive Computing


Security Ninety-one percent of commercial applications contain outdated or abandoned open-source components —a security threat, says Synopsys in its recently released report 2020 Open Source Security and Risk Analysis (OSSRA). In the fifth annual edition of the report, Synopsys’ research team in its Cybersecurity Research Center (CyRC) found that 99% of the 1,250 commercial codebases revie... » read more

Tracking Automotive’s Rapidly Shifting Ecosystem


The automotive ecosystem is becoming much harder to navigate as automakers, Tier 1s and IP vendors redefine their relationships based upon shifting value caused by an rapidly expanding amount of increasingly interdependent and complex electronic content. Predictions of massive change started almost a decade ago with a number of pilot programs around autonomous vehicles. But those shifts real... » read more

Week In Review: Auto, Security, Pervasive Computing


AI/Edge Brewer Science is introducing its first material for permanent bond used in assembling ICs, image sensor devices, and MEMS for devices and packaging that “include low-temperature bonding, extreme chemical resistance, UV or thermal curable bonding process, and no material movement after cure,” according to a press release. The bond is part of the PermaSOL product family. “These hi... » read more

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