Time-to-market pressures and the increasing need for faster and smaller devices require an integrated methodology for design-for-test (DFT) synthesis.
Increased pressures on design teams to deliver faster, smaller devices in less time has required EDA companies to develop an integrated methodology to incorporate physical design information during DFT synthesis. This solution must consider the placeable area (or size) of the circuit as well as routing blockages and hard macro placement locations. It must also be able to both model the wiring interconnect given component placement locations, and build and incorporate the DFT structures into the placed design while consid- ering its physical surroundings and wiring constraints.
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