Navigating the transition from traditional monolithic architectures to multi-die and chiplet-based solutions.
This eBook provides a resource for innovators in the fast-changing realm of AI chip development. It delves into the opportunities and challenges of designing cutting-edge AI chips and chiplets, focusing on the transition from traditional monolithic architectures to multi-die and chiplet-based solutions. The content covers essential topics such as architectural exploration, silicon design, advanced packaging, early software development, and security considerations, offering insights into the strategic choices required for achieving first-pass silicon success.
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