tag: AI chips

Making Tradeoffs With AI/ML/DL
By Ann Mutschler - 11 May, 2023 - Comments: 0

Machine learning, deep learning, and AI increasingly are being used in chip design, and they are being used to design chips that are optimized for ML/DL/AI. The challenge is understanding the tradeoffs on both sides, both of which are becoming increasingly complex and intertwined. On the design side, machine learning has been viewed as just another tool in the design team's toolbox. That's s... » read more

A crossbar array of magnetoresistive memory devices for in-memory computing
By Technical Paper Link - 14 Jan, 2022 - Comments: 0

Samsung has demonstrated the world’s first in-memory computing technology based on MRAM. Samsung has a paper on the subject in Nature. This paper showcases Samsung’s effort to merge memory and system semiconductors for next-generation artificial intelligence (AI) chips. Abstract "Implementations of artificial neural networks that borrow analogue techniques could potentially offer low-po... » read more

Architectural Considerations For AI
By Brian Bailey - 24 Jun, 2021 - Comments: 2

Custom chips, labeled as artificial intelligence (AI) or machine learning (ML), are appearing on a weekly basis, each claiming to be 10X faster than existing devices or consume 1/10 the power. Whether that is enough to dethrone existing architectures, such as GPUs and FPGAs, or whether they will survive alongside those architectures isn't clear yet. The problem, or the opportunity, is that t... » read more

The Benefits Of Using Embedded Sensing Fabrics In AI Devices
By Moortec - 11 Nov, 2020 - Comments: 0

AI chips, regardless of the application, are not regular ASICs and tend to be very large, this essentially means that AI chips are reaching the reticle limits in-terms of their size. They are also usually dominated by an array of regular structures and this helps to mitigate yield issues by building in tolerance to defect density due to the sheer number of processor blocks. The reason behind... » read more

Variables Complicate Safety-Critical Device Verification
By Ann Mutschler - 01 Jul, 2020 - Comments: 0

The inclusion of AI chips in automotive and increasingly in avionics has put a spotlight on advanced-node designs that can meet all of the ASIL-D requirements for temperature and stress. How should designers approach this task, particularly when these devices need to last longer than the applications? Semiconductor Engineering sat down to discuss these issues with Kurt Shuler, vice president of... » read more

Startup Funding: March 2020
By Jesse Allen - 08 Apr, 2020 - Comments: 0

Dedicated AI hardware, quantum computing, and avionics startups shined in March. Here's a look at seventeen startups, which raised a collective $525M. The avionics sector soared thanks to Lilium and its electric vertical takeoff jet. Quantum computing was another hot area, with three companies bringing in ~$88M together. Plus, chip design management, two companies developing AR glasses, and how... » read more

Defining And Improving AI Performance
By Brian Bailey - 12 Dec, 2019 - Comments: 2

Many companies are developing AI chips, both for training and for inference. Although getting the required functionality is important, many solutions will be judged by their performance characteristics. Performance can be measured in different ways, such as number of inferences per second or per watt. These figures are dependent on a lot of factors, not just the hardware architecture. The optim... » read more

Thermal Challenges In Advanced Packaging
By Ed Sperling - 02 Dec, 2019 - Comments: 2

CT Kao, product management director at Cadence, talks with Semiconductor Engineering about why packaging is so complicated, why power and heat vary with different use cases and over time, and why a realistic power map is essential particularly for AI chips, where some circuits are always on.   Interested in more Semiconductor Engineering videos? Sign-up for our YouTube channel here » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 14 Jun, 2019 - Comments: 0

Market research In the second quarter of 2019, TrendForce said that the top-5 foundry rankings remained identical with that of last year. But sixth to tenth place showed some changes. Who is up or down in what is a tough business climate? Global fab equipment spending will rebound in 2020, growing 20% to $58.4 billion after dropping 19% to $48.4 billion in 2019, according to SEMI. However, ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 07 Jun, 2019 - Comments: 0

Market research IC Insights has released its forecast for chips in terms of applications. Communications is still the biggest IC market, but automotive is growing the fastest. In its first forecast of artificial intelligence (AI) edge processors, International Data Corp. (IDC) estimates that worldwide shipments of AI-optimized processors for edge systems will reach 340.1 million units in 20... » read more

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