Why microLeadFrame (MLF)/ quad flat no-lead (QFN) packaging technology is the fastest growing IC packaging solution today.
MicroLeadFrame (MLF)/ quad flat no-lead (QFN) packaging technology is the fastest growing IC packaging solution today. From a market segment perspective, MLF packaging solutions represent more than a 111B-unit market for 2022 across five markets: automotive, consumer, industrial, networking, and communications (Figure 1). The package solution requirements across these markets vary but, the fundamental values the MLF packaging brings to each one is consistently the same: 1) a flexible form factor, 2) adaptable interconnect technology, 3) electrical and thermal performance, and 4) a cost-effective solution.
Read more here. (Note that Amkor Technology maintains a copy of this white paper, originally published story in Chip Review magazine, on its website.)
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