Power Delivery Issues


By Ed Sperling Reducing the voltage in a system on chip is like turning down the water pressure on a home plumbing system. Pretty soon you find out that not all the faucets work properly because there isn’t enough pressure behind them. While it’s vital to drop the voltage to boost battery life in mobile devices, not to mention reduce the overall power consumption in plug-in devices, t... » read more

The FPGA Alternative


By Geoffrey James Until a few years ago, SoC designers focused almost exclusively on ASICs. While it was theoretically possible to create an SoC design for an FPGA, the programmable chips were too bulky and pricey to be useful for much more than prototyping. Today, however, designers are increasingly turning to FPGAs for their SOC targets for production systems. Why the sudden upsurge in So... » read more

The Abstraction of Test


By Ann Steffora Mutschler By now, semiconductor design abstraction is old hat to many engineers, but mention the term “semiconductor test abstraction” and expect a blank stare in return. Design complexity, enormous design size, and short market windows have put tremendous pressure on test to occur earlier rather than later. Even at the RTL level, where hardware test typically has not ... » read more

Making Connections


By Ed Sperling The world is still full of engineers who can build fast interconnects to things like PCI Express or USB 2.0 who can create complex schematics for determining the connections between a processor core, memory, logic and various IP blocks on a piece of silicon. But over the next several years, many of those engineers will have to figure out new ways to make a living. The numbe... » read more

Considerations For Choosing The Right Low-Power Tools


By Cheryl Ajluni Regardless of what you are designing these days, one fact holds true: Your design is only as good as the design tools you use. Gone are the days when a design could be done on the back of napkin. Today, engineers require a complex ecosystem of interworking tools to guide them through the complex design flow. This is especially true when it comes to low-power design, as i... » read more

Defining Reliability In Low-Power Designs


By Ann Steffora Mutschler Having a clear understanding of what reliability means for a particular low-power application can make a significant difference when it comes to communicating with engineering team members and customers. Is reliability simply a question of how long a device can run without errors? And what happens to reliability when power modeling, verification and other design tec... » read more

Experts At The Table: What’s Next?


Low-Power Design sat down with Leon Stok, EDA director for IBM’s System & Technology Group; Antun Domic, senior vice president and general manager of Synopsys’ Implementaton Group; Prasad Subramaniam, vice president of design technology at eSilicon, and Bernard Murphy, chief technology officer at Atrenta. What follows are excerpts of that conversation. By Ed Sperling LPD: Where... » read more

Experts At The Table: What’s Next?


Low-Power Design sat down with Leon Stok, EDA director for IBM’s System & Technology Group; Antun Domic, senior vice president and general manager of Synopsys’ Implementaton Group; Prasad Subramaniam, vice president of design technology at eSilicon, and Bernard Murphy, chief technology officer at Atrenta. What follows are excerpts of that conversation. LPD: What will happen with ... » read more

Verification As A Deterrent?


By Ed Sperling Verification is becoming more than a bottleneck in semiconductor design. It’s actually deterring companies from adopting the latest techniques for saving power or building certain features into chips. The problem is one of complexity, and it’s getting worse at every node. While the tools exist to do complex designs, there are the classic tradeoffs of area, power and per... » read more

Experts At The Table: Evolving Standards


System-Level Design sat down with Keith Barkley, senior engineer in IBM’s systems and technology group; Steven Schulz, president and CEO of Silicon Integration Initiative (Si2); Yatin Trivedi, director of standards and interoperability programs at Synopsys; Ian Mackintosh, chairman of the OCP International Partnership (OCP-IP), and Michael Meredith, vice president of technical marketing at ... » read more

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