A look at the strategies behind different packaging types and approaches.
Ever open the body of your smartphone (perhaps unintentionally) and see small, black rectangles stuck on a circuit board? Those black rectangles are packaged chips. The external chip structure protects the fragile integrated circuits inside, as well as dissipates heat, keeps chips isolated from each other, and, importantly, provides connection to the circuit board and other elements. The manufacturing steps involved in creating these protective structures and connections are collectively known as “packaging.” This activity has seen revolutionary changes in recent years, propelled by the drive for smaller and more powerful chips.
Here we take a look at some of the strategies that enable next-generation advanced packaging, including wafer-level packaging, bumping, redistribution layers, fan out, and through-silicon vias. These are great examples of applying front-end wafer manufacturing technologies (such as deposition, etch, and clean) to back-end processing. To read more, click here.
 |
 |
 |
 |
 |
 |
 |  |
Leave a Reply