A new technical paper titled “Flip chip bonding on stretchable printed substrates; the effects of stretchable material and chip encapsulation” was published by researchers at Silicon Austria Labs and Institute for Smart Systems Technologies.
Abstract
“Stretchable printed electronics have recently opened up new opportunities and applications, including soft robotics, electronic skins, human-machine interfaces, and healthcare monitoring. Stretchable hybrid systems (SHS) leverage the benefits of low-cost fabrication of printed electronics with high-performance silicon technologies. However, direct integration of silicon-based devices on conventional stretchable substrates such as thermoplastic polyurethane (TPU) and polydimethylsiloxane (PDMS) is extremely challenging due to their restricted low-temperature processing. In this study, a recently developed thermoset, stretchable substrate (BeyolexTM) with superior thermal and mechanical properties was employed to realize SHS via direct flip chip bonding. Here, ultra-thin chips (UTC) with a fine-pitch, daisy-chain structure was flip-chip bonded by using anisotropic conductive adhesives, while the complementary circuitry was facilitated via screen-printed, stretchable silver tracks. The bonded samples successfully passed reliability assessments after being subjected to cyclic 30% stretch tests for 200 cycles. The potential benefits of chip encapsulation after integration with the stretchable substrate to withstand larger strains were demonstrated by both mechanical simulation and experimental results.”
Find the open access technical paper here. Published January 2023.
Malik, M. H., Kaczynski, J., Zangl, H., & Roshanghias, A. (2023). Flip Chip Bonding on Stretchable Printed Substrates; The Effects of Stretchable Material and Chip Encapsulation. Flexible and Printed Electronics. DOI 10.1088/2058-8585/acb2d9.
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