Printed Electronics: Direct Flipchip Bonding of Ultra-Thin Chip On A Recently-Developed Stretchable Substrate

A new technical paper titled "Flip chip bonding on stretchable printed substrates; the effects of stretchable material and chip encapsulation" was published by researchers at Silicon Austria Labs and Institute for Smart Systems Technologies. Abstract "Stretchable printed electronics have recently opened up new opportunities and applications, including soft robotics, electronic skins, human-... » read more

Die-level Thinning and Integrating Route For Singulated MPW Chips Using Both Silicon Sensors and CMOS Devices

Abstract "Die-level thinning, handling, and integration of singulated dies from multi-project wafers (MPW) are often used in research, early-stage development, and prototyping of flexible devices. There is a high demand for thin silicon devices for several applications, such as flexible electronics. To address this demand, we study a novel post-processing method on two silicon devices, an el... » read more