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Reduce 3D-IC Design Complexity: Early Package Assembly Verification

Verifying and debugging complex multi-dimensional systems earlier in the flow using multi-physics analysis.

April 24th, 2024 - By: Siemens EDA
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Uncover the unique challenges, along with the latest Calibre verification solutions, for 3D-IC design in this new technical paper. As 2.5D and 3D-ICs redefine the possibilities of semiconductor design, discover how Siemens is leading the way in verifying complex multi-dimensional systems, while shifting verification left to do so earlier in the design process.

What you’ll learn:

  • Overcome the distinct challenges of 3D-IC design and verification
  • Reduce debugging efforts by identifying and addressing issues earlier in the design flow
  • Utilize the power of post-assembly netlist generation for comprehensive verification
  • Ensure design integrity with multi-physics analysis
  • Automate the integration of design-specific data for efficiency and accuracy

“Leading semiconductor companies are already successfully leveraging Calibre Shift left solutions for 2.5D and 3DIC design to decrease design iterations and get to market faster.”– John Ferguson, author

Who should read this:

  • Chiplet designers seeking to enhance chiplet integration and performance
  • Package layout designers aiming to optimize 3DIC layouts
  • IC and SoC designers interested in the latest advancements in semiconductor design
  • Thermal mechanical engineers focused on addressing stress and temperature concerns in 3D-ICs

To read more, click here.


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