Verifying and debugging complex multi-dimensional systems earlier in the flow using multi-physics analysis.
Uncover the unique challenges, along with the latest Calibre verification solutions, for 3D-IC design in this new technical paper. As 2.5D and 3D-ICs redefine the possibilities of semiconductor design, discover how Siemens is leading the way in verifying complex multi-dimensional systems, while shifting verification left to do so earlier in the design process.
What you’ll learn:
“Leading semiconductor companies are already successfully leveraging Calibre Shift left solutions for 2.5D and 3DIC design to decrease design iterations and get to market faster.”– John Ferguson, author
Who should read this:
To read more, click here.
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