tag: 14nm

Foundries Face Challenges in 2016
By Mark LaPedus - 17 Dec, 2015 - Comments: 2

Generally, 2015 has been a challenging year in the foundry business. For one thing, the foundry industry will register modest growth in 2015. In addition, the foundry customer base is consolidating. And on the leading edge, foundries took longer than expected to ramp up their 16nm/14nm finFET processes. So, after an eventful year in 2015, what’s in store for the foundry business in 2016? I... » read more

Reflections On 2015
By Brian Bailey - 10 Dec, 2015 - Comments: 0

It is easy to make predictions, but few people can make them with any degree of accuracy. Most of the time, those predictions are forgotten by the end of the year and there is no one to do a tally of who holds more credibility for next year. Not so with Semiconductor Engineering. We like to hold people's feet to the fire, but while the "Pants-On-Fire" meter may be applicable to politicians, we ... » read more

The Pain Of Change
By Ed Sperling - 24 Nov, 2015 - Comments: 0

If the still evolving shift left has taught the semiconductor industry anything, it's that nothing can be counted on to stay the same for very long. The basic proposition of doing more earlier in the design cycle to speed up time to market—and thereby shifting everything left in the linear flow—means that every silo that has been constructed over the past several decades needs to be rethoug... » read more

Tech Talk: 14nm And Stacked Die
By Ed Sperling - 11 Nov, 2015 - Comments: 0

Aashish Malhotra, marketing director for the ASIC Business Unit at GlobalFoundries, talks about 14nm process technology, the IP ecosystem, and why that technology node will be used as a platform for 2.5D and 3D stacked die across a wide range of markets including the Internet of Everything. [youtube vid=ukTRuedB7ZU] » read more

China’s Fab Tool Biz Heats Up
By Mark LaPedus - 28 Oct, 2015 - Comments: 0

For years, China has been a steady growth market for suppliers of semiconductor equipment. Internally, though, the country is comprised of trailing-edge fabs and IC-assembly houses, which means equipment vendors sell relatively mature tools and compete on price. That’s about to change, however. Today, the IC equipment business is heating up in China as the nation begins to upgrade and pour... » read more

What China Is Planning
By Mark LaPedus - 21 Oct, 2015 - Comments: 1

Over the years, China has unveiled several initiatives to advance its domestic semiconductor industry. China has made some progress at each turn, although every plan has fallen short of expectations. But now, the nation is embarking on several new and bold initiatives that could alter the IC landscape. China’s new initiatives address at least three key challenges for its IC industry: 1. C... » read more

Abstraction: Necessary But Evil
By Brian Bailey - 14 Oct, 2015 - Comments: 1

Abstraction allows aspects of a design to be described in an executable form much earlier in the flow. But some abstractions are breaking down, and an increasing amount of lower-level information has to be brought upstream in order to provide estimates that are close enough to reality so informed decisions can be made. The value of abstractions in design cannot be overstated. High levels of ... » read more

Pick A Number
By Ed Sperling - 24 Sep, 2015 - Comments: 0

For the past two years there was some mumbling that 16/14nm would be short-lived, and that 10nm would be the place that foundries would invest heavily. Now the buzz is that 10nm may be skipped entirely and the next node will be 7nm. After all, 10nm is really only a half-node. Or is it? The answer depends on who's defining 10nm. The 16/14nm node is based on a 20nm back-end-of-line process, un... » read more

A Strategy For Designing For Power With FinFETs
By Anand Iyer - 11 Sep, 2015 - Comments: 0

Recently Qualcomm announced their new SnapDragon processor 820, which was designed using finFET technology. They showed some amazing results, such as 2X improvement in performance and 2X improvement in power compared to 28nm designs. Previously, when ARM announced their A72 processors in finFET, they too had claimed 3.5X improvement in power compared to 28nm designs. But can designers expect... » read more

Challenges At Advanced Nodes
By Ed Sperling - 09 Sep, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss finFETs, 22nm FD-SOI and how the how the market will segment over the next few years with Marie Semeria, CEO of [getentity id="22192" e_name="Leti"]; Patrick Soheili, vice president of product management and corporate development at [getentity id="22242" e_name="eSilicon"]; Paul Boudre, CEO of Soitec; and Subramani Kengeri, vice president of global ... » read more

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