3D NAND Market Heats Up

By Mark LaPedus - 19 Feb, 2015 - Comments: 4

After some delays and uncertainty in past years, the 3D NAND market is finally heating up. In 2013 and 2014, Samsung was the only vendor participating in the 3D NAND market. Most other suppliers were supposed to ship 3D NAND devices in volumes last year, but vendors pushed out their production dates for various business and technical reasons. Going into 2015, [getentity id="22865" e_nam... » read more

Executive Insight: Aki Fujimura

By Mark LaPedus - 16 Oct, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss photomask technology and lithography trends with Aki Fujimura, chairman and chief executive of D2S. SE: What are the big challenges that keep you awake at night? Fujimura: Mask technology, and the investments in the mask industry, are increasingly important. But so far, the investment dollars that the community is willing to spend on it isn’... » read more

What If EUV Fails?

By Mark LaPedus - 17 Apr, 2014 - Comments: 2

It’s the worst kept secret in the industry, but extreme ultraviolet (EUV) lithography will likely miss the 10nm node. So, chipmakers will likely extend and use today’s 193nm immersion lithography down to 10nm. This, of course, will require a complex and expensive multiple patterning scheme. Now, chipmakers are formulating their lithography strategies for 7nm and beyond. As it stands now,... » read more

Directed Self-Assembly Gains Momentum

By Mark LaPedus - 20 Mar, 2014 - Comments: 0

At last year’s SPIE Advanced Lithography symposium, directed self-assembly (DSA) grabbed the spotlight as chipmakers provided the first glimpse of their initial work and results with the technology. The results were stunning, thereby propelling DSA from a curiosity item to a possible patterning solution for next-generation devices. Last year, in fact, GlobalFoundries, IBM, Intel and Sams... » read more

Knowledge Centers
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tag: 193nm immersion lithography

3D NAND Market Heats Up

Executive Insight: Aki Fujimura

What If EUV Fails?

Directed Self-Assembly Gains Momentum