Reliability Performance Of S-Connect Module (Bridge Technology) For Heterogeneous Integration Packaging

By Heejun Jang - 23 Jul, 2024 - Comments: 0

With the explosive increase in demand for artificial intelligence (AI), autonomous driving, Internet of Things (IoT), data centers, augmented reality and virtual reality (AR/VR), the market of high-performance computing (HPC) applications is growing rapidly [2]. And, the HPC market requires high processing speed, fast network clusters and large parallel computing. To meet the market requirement... » read more

Challenges And Innovations Of HW Security And Trust For Chiplet-Based 2.5D and 3D ICs

By Technical Paper Link - 04 Jan, 2024 - Comments: 0

A technical paper titled “On hardware security and trust for chiplet-based 2.5D and 3D ICs: Challenges and Innovations” was published by researchers at STMicroelectronics Crolles (ST-CROLLES), Département Systèmes et Circuits Intégrés Numériques (DSCIN), Techniques de l'Informatique et de la Microélectronique pour l'Architecture des systèmes intégrés (TIMA), and Laboratoire Systèm... » read more

Chiplet Placer with Thermal Consideration for 2.5D ICs

By Technical Paper Link - 27 Feb, 2023 - Comments: 0

A new technical paper titled "Chiplet Placement for 2.5D IC with Sequence Pair Based Tree and Thermal Consideration" was published by researchers at National Yang Ming Chiao Tung University (Taiwan). Abstract "This work develops an efficient chiplet placer with thermal consideration for 2.5D ICs. Combining the sequence-pair based tree, branch-and-bound method, and advanced placement/pruning... » read more

HBM3: Big Impact On Chip Design

By Ann Mutschler - 14 Oct, 2021 - Comments: 0

An insatiable demand for bandwidth in everything from high-performance computing to AI training, gaming, and automotive applications is fueling the development of the next generation of high-bandwidth memory. HBM3 will bring a 2X bump in bandwidth and capacity per stack, as well as some other benefits. What was once considered a "slow and wide" memory technology to reduce signal traffic dela... » read more

Speeding Up 3D Design

By Brian Bailey - 14 Nov, 2019 - Comments: 0

2.5D and 3D designs have garnered a lot of attention recently, but when should these solutions be considered and what are the dangers associated with them? Each new packaging option trades off one set of constraints and problems for a different set, and in some cases the gains may not be worth it. For other applications, they have no choice. The tooling in place today makes it possible to de... » read more

Why Chips Die

By Brian Bailey - 12 Nov, 2018 - Comments: 4

Semiconductor devices contain hundreds of millions of transistors operating at extreme temperatures and in hostile environments, so it should come as no surprise that many of these devices fail to operate as expected or have a finite lifetime. Some devices never make it out of the lab and many others die in the fab. It is hoped that most devices released into products will survive until they be... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer