tag: 3D ICs

NoCs In 3D Space
By Brian Bailey - 03 Apr, 2024 - Comments: 0

A network on chip (NoC) has become an essential piece of technology that enables the complexity of chips to keep growing, but when designs go 3D, or when third-party chiplets become pervasive, it's not clear how NoCs will evolve or what the impact will be on chiplet architectures. A NoC enables data to move between heterogeneous computing elements, while at the same time minimizing the resou... » read more

The City In The Tower: 3D ICs Transform The Electronics System Landscape
By Keith Felton - 14 Mar, 2024 - Comments: 0

By Keith Felton and Todd Burkholder The time of 3D integrated circuits (3D ICs) is here, and they will revolutionize the semiconductor industry and effect a watershed in the nature of electronics products that can be designed and manufactured. Yet again—as with personal computers, the internet, and smart phones—our increasingly digital world will never be the same. 3D IC architectures... » read more

Impact Of 3DHI On Aerospace And Government Applications
By Ian Land - 15 Feb, 2024 - Comments: 0

By Ian Land, Kenneth Larsen, and Rob Aitken With challenging size, weight, and power (SWaP) requirements, chip designs for aerospace, defense, and government applications are a unique breed. No surprise here, considering systems like satellites and submarines must operate reliably in the distinctly harsh environments of outer space and ocean depths, respectively. Given the SWaP criteria a... » read more

Challenges And Innovations Of HW Security And Trust For Chiplet-Based 2.5D and 3D ICs
By Technical Paper Link - 04 Jan, 2024 - Comments: 0

A technical paper titled “On hardware security and trust for chiplet-based 2.5D and 3D ICs: Challenges and Innovations” was published by researchers at STMicroelectronics Crolles (ST-CROLLES), Département Systèmes et Circuits Intégrés Numériques (DSCIN), Techniques de l'Informatique et de la Microélectronique pour l'Architecture des systèmes intégrés (TIMA), and Laboratoire Systèm... » read more

What You Needed To Know In 2023
By Brian Bailey - 21 Dec, 2023 - Comments: 0

I always use the last blog of the year to review everything published in the Systems & Design and Low Power – High Performance channels of Semiconductor Engineering, the two channels that I write for. It is useful to see what interests you and, as I have found in the past, it is an indicator of where the industry is going. You read about the issues you are facing as designers, and you nee... » read more

2023: A Good Year For Semiconductors
By Brian Bailey - 21 Dec, 2023 - Comments: 0

Looking back, 2023 has had more than its fair share of surprises, but who were the winners and losers? The good news is that by the end of the year, almost everyone was happy. That is not how we exited 2022, where there was overcapacity, inventories had built up in many parts of the industry, and few sectors — apart from data centers — were seeing much growth. The supposed new leaders we... » read more

Proprietary Vs. Commercial Chiplets
By Ed Sperling - 19 Dec, 2023 - Comments: 0

Large chipmakers are focusing on chiplets as the best path forward for integrating more functions into electronic devices. The challenge now is how to pull the rest of the chip industry along, creating a marketplace for third-party chiplets that can be chosen from a menu using specific criteria that can speed time to market, help to control costs, and behave as reliably as chiplets developed in... » read more

Closing The Test And Metrology Gap In 3D-IC Packages
By Gregory Haley - 12 Dec, 2023 - Comments: 0

The industry is investing in more precise and productive inspection and testing to enable advanced packages and eventually, 3D ICs. The next generations of aerospace, automotive, smartphone, and wearable tech most likely will be powered by multiple layers of intricately connected silicon, a stark departure from the planar landscapes of traditional integrated circuits. These 3D-ICs, compos... » read more

3D-ICs May Be The Least-Cost Option
By Brian Bailey - 30 Nov, 2023 - Comments: 1

When 2.5D and 3D packaging were first conceived, the general consensus was that only the largest semiconductor houses would be able to afford them, but development costs are quickly coming under control. In some cases, these advanced packages actually may turn out to be the lowest-cost options. With stacked die [1], each die is considered to be a complete functional block or sub-system. In t... » read more

Help, 3D-IC Is Stuck In A Country Song
By John Ferguson - 30 Nov, 2023 - Comments: 0

Every time I focus on three-dimensional (3D) integrated circuit (IC) design, I start hearing the Luke Bryan song “Rain Makes Corn, Corn Makes Whiskey.” Not because I need a strong drink to work with 3D-IC designs, but because there is a similar, although slightly more complicated, series of cause and effect issues that impact 3D-ICs. Pushing electrons through very thin metal wires and switc... » read more

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