NanoResolution MRS Sensor: Fast, Precise 3D Inspection And Measurement for Advanced Semiconductor Packaging Applications


The semiconductor packaging industry continues to advance, with new designs adding more layers, finer features and more I/O channels to achieve faster connections, higher bandwidth and lower power consumption. As packaging technologies have evolved, manufacturers have adapted old processes and adopted new processes to connect chips to each other and to the outside world. Often these new process... » read more

Extending 3D MRS Sensor Technology To Address Challenging Measurement And Inspection Applications


There is an increasing need for highly accurate 3D inspection and measurement capabilities for applications in SMT, semiconductor and metrology markets. 3D Multiple Reflection Suppression (MRS) sensor technology has been effectively combined with Automated Optical Inspection for several years and is now being utilized for many SPI applications such as microelectronics and sub-100-micron sold... » read more