The Week In Review: Manufacturing


This week, IBM began to cut jobs amid lackluster results. Big Blue is also in the process of selling its chip unit to GlobalFoundries. GlobalFoundries said the jobs are safe at IBM Micro, at least for now, according to a report the Press and Sun-Bulletin. What’s the latest with Applied Materials’ proposed acquisition with Tokyo Electron Ltd. (TEL)? “Germany, Israel and Singapore approv... » read more

The Week In Review: Manufacturing


A majority of Americans cannot endure more than two hours without checking their electronic devices, according to new data released in the Crucial.com Tech-Life Balance Survey. One in four Americans becomes stressed by going longer than 30 minutes without checking their email or phone due to a fear of missing out. Additionally, one in five would sooner go to dinner with an ex significant other ... » read more

Ion Implanter Market Heats Up


The ion implanter market has been a stable, if not a sleepy, business. The last big event took place in 2011, when Applied Materials re-entered the ion implanter market by acquiring Varian, the world’s leading supplier of these tools. The acquisition gave Applied Materials a commanding 80% share of the implanter business, with the other players fighting for the crumbs. But after year... » read more

Changes In NAND Flash Market


Things are changing quickly in the NAND flash market. Newcomers are challenging long-time market leaders and shifting the lineup in this market. A survey of NAND flash vendors, conducted by DRAMeXchange, a Singapore market research firm, shows that in Q1 of this year Samsung was firmly in first place with $2.175 billion in revenues, followed by Toshiba with $1.548 billion and SanDisk with $1... » read more

Has 3D NAND Fallen Flat?


Today’s planar NAND technology will hit the wall at 10nm, prompting the need for the next big thing in flash memory—3D NAND. In fact, 3D NAND may extend NAND flash memory for the next several years and enable new applications. And it will also drive a new wave of fabs and tool orders. But the transition won’t be as smooth as previous rollouts. 3D NAND is harder to manufacture than pr... » read more

The Week In Review: Manufacturing


According to one analyst, the capital spending picture looks gloomy. “We expect finFET and 3D NAND to ramp over the next two years. However, foundry and memory customers are showing great restraint with respect to spending plans, limiting the rate of new node transitions and overall capex upside. In the near term, we see no evidence of meaningful equipment orders to support high-volume finFET... » read more

The Week In Review: Manufacturing


About 150 to 200 employees from IBM’s chip unit will be dispatched to work at GlobalFoundries, according to the Poughkeepsie Journal. GlobalFoundries said the arrangement is temporary, according to the report. GlobalFoundries is the leading candidate to buy IBM’s chip unit, which is apparently on the block. To date, however, GlobalFoundries and IBM have yet to make any announcements on the... » read more

Big Memory Shift Ahead


System architecture has been driven by the performance of [getkc id="22" kc_name="memory"]. Processor designers would have liked all of the memory be fast [getkc id="92" kc_name="SRAM"], placed on-chip for maximum performance, but that was not an option. Memory had to be fabricated as separate chips and connected via a Printed Circuit Board (PCB). That limited the number of available I/O ports ... » read more

The Week In Review: Manufacturing


Worldwide semiconductor capital equipment spending is projected to total $37.5 billion in 2014, an increase of 12.2% from 2013 spending of $33.5 billion, according to Gartner. Capital spending will increase 5.5% in 2014 as the industry begins to recover from the recent economic downturn. The 3D NAND market will take longer to develop. Samsung has shipped a 3D NAND device. Micron and SK Hynix... » read more

The Week In Review: Manufacturing


There is more evidence of a fab tool slowdown. In fact, ASML itself sounded the alarm during its earnings conference call this week. “ASML noted uncertainty regarding the timing of both the 16/14 nm finFET ramp at foundries (the company is seeing a delay from customers as the technology is still in development, in our view) and 3D NAND,” said Weston Twigg, an analyst from Pacific Crest Secu... » read more

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