Process Model Calibration: Building Predictive and Accurate 3D Process Models

By Coventor - 20 Aug, 2020 - Comments: 0

The semiconductor industry has always faced challenges caused by device scaling, architecture evolution and process complexity and integration. These challenges are coupled with a need to provide new technology to the market quickly. In the initial stages of semiconductor technology development, innovative process flow schemes must be tested using silicon test wafers. These wafer tests are leng... » read more

Bringing Advanced Semiconductor Manufacturing Technologies To Higher Education

By Jimmy Gu - 17 Nov, 2016 - Comments: 0

Universities and other institutions of higher learning play a key role in developing our next generation of semiconductor technologies. Along with the theory of semiconductor technology, our next generation of scientists and engineers must learn about the practical methods used to design and manufacture the latest generation of semiconductor products. Recently, Coventor’s predictive, 3D proce... » read more

Virtual Fabrication For MEMS Process Development

By Coventor - 20 Jul, 2016 - Comments: 0

MEMS fabrication and design are closely coupled, such that design changes could significantly alter the process flow and vice versa. For instance, setting device parameters such as drive capacitance, deflection distance, or proof mass size directly affects the choice of film thickness, etch rate, sidewall profile and so forth. Typically, this requires multiple iterations of the MEMS design/proc... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: 3D process modeling

Process Model Calibration: Building Predictive and Accurate 3D Process Models

Bringing Advanced Semiconductor Manufacturing Technologies To Higher Education

Virtual Fabrication For MEMS Process Development