tag: 450mm

Applied-TEL Watch
By Mark LaPedus - 17 Oct, 2013 - Comments: 0

By Mark LaPedus So far this year, the biggest story in the fab tool industry is fairly obvious—Applied Materials recently signed a definitive agreement to acquire rival Tokyo Electron Ltd. (TEL) for about $9.3 billion. The blockbuster announcement will likely be the top story of 2013. Of course, the integration of Applied and TEL will be a challenge. In any case, the Applied-TEL deal is i... » read more

Executive Briefing: Getting Direct On Litho
By Mark LaPedus - 17 Oct, 2013 - Comments: 0

Semiconductor Engineering sat down and talked with David Lam, principal of the David Lam Group, an investment and advisory firm. Lam is also the chairman of Multibeam, a multi-beam equipment startup for direct-write lithography and other applications. He founded Lam Research in 1980 and left as an employee in 1985. He served on Lam Research’s board for five years after that. SE: Multibeam ... » read more

Semicon West Lithography Report
By Chris Mack - 29 Sep, 2013 - Comments: 0

OK, I have to admit this right off:  I didn’t go to Semicon West (held two weeks ago in San Francisco).  I try never to go to Semicon West (I’ve been twice in the last 30 years, both times against my will).  Why should I go?  To listen to the latest marketing messages and company spin?  To see a few technical talks that are way too light on the technical, but still full of talk?  I do... » read more

The Week In Review: Sept. 23
By Mark LaPedus - 23 Sep, 2013 - Comments: 0

By Mark LaPedus For some time, Apple’s iPhones have incorporated a separate RF switch and diversity switch from Peregrine Semiconductor (PSMI). The switches are based on a silicon-on-insulator (SOI) variant called silicon-on-sapphire (SOS). Murata takes Peregrine’s RF switches and integrates them into a module. Doug Freedman, an analyst with RBC Capital, said Apple is no longer using PSMI�... » read more

Litho Roadmap Remains Cloudy
By Mark LaPedus - 19 Sep, 2013 - Comments: 0

By Mark LaPedus For some time, the lithography roadmap has been cloudy. Optical lithography has extended much further than expected. And delays with the various next-generation lithography (NGL) technologies have forced the industry to re-write the roadmap on multiple occasions. Today, there is more uncertainty than ever in lithography. Until recently, for example, leading-edge logic chipma... » read more

Experts At The Table: Process Technology Challenges
By Mark LaPedus - 13 Sep, 2013 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss future transistor, process and manufacturing challenges with Subramani Kengeri, vice president of advanced technology architecture at GlobalFoundries; Carlos Mazure, chief technical officer at Soitec; Raj Jammy, senior vice president and general manager of the Semiconductor Group at Intermolecular; and Girish Dixit, v... » read more

450mm Is On Its Way!
By Adrienne Downey - 15 Aug, 2013 - Comments: 0

By Adrienne Downey Intel finally has taken the big plunge into 450mm manufacturing with the announcement of the start of construction of fab D1X Module 2. The company plans to spend $2 billion on construction of the new development fab this year alone. Its twin fab, Module 1, is 450mm-compatible, but will begin production later this year as a 300mm fab running a 14nm process technology. Intel�... » read more

Japan: Latest Investment Activities
By Dan Tracy - 15 Aug, 2013 - Comments: 0

By Dan Tracy and Yoichiro Ando Restructuring and consolidation has led to a new focus for the semiconductor manufacturers in Japan. As a result, the semiconductor equipment market in Japan will experience double-digit growth in both 2013 and 2014, driven by higher spending for memory production and in spending increases planned for the manufacturing of power semiconductors and “More than Moo... » read more

Experts At The Table: 450mm Fab And Facilities Challenges
By Mark LaPedus - 09 Aug, 2013 - Comments: 0

Semiconductor Manufacturing & Design sat down to discuss future 450mm fab and facilities challenges with Gerald Goff, director of the project management office for fab design and construction at GlobalFoundries; Joe Cestari, president of Total Facility Solutions; Ivo Raaijmakers, chief technology officer of ASM International; and Michael Brain, senior director of the Fab Solutions Business ... » read more

Experts At The Table: 450mm Fab And Facilities Challenges
By Mark LaPedus - 02 Aug, 2013 - Comments: 0

Semiconductor Manufacturing & Design sat down to discuss future 450mm fab and facilities challenges with Gerald Goff, director of the project management office for fab design and construction at GlobalFoundries; Joe Cestari, president of Total Facility Solutions; Ivo Raaijmakers, chief technology officer of ASM International; and Michael Brain, senior director of the Fab Solutions Business... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy