Manufacturing Constraint Fears Grow

By Ed Sperling - 18 Dec, 2014 - Comments: 0

The semiconductor industry could become a victim of its own success. With so many semiconductors being consumed inside of cars, home electronics and industry, capacity shortages are beginning to surface in some areas. Foundries set rates depending upon a complex mix of process technology, equipment depreciation, customer demand and the need to push customers from one node the next depending ... » read more

Resurrecting The Semiconductor Industry

By Satish Bagalkotkar - 24 Jul, 2014 - Comments: 0

Every so often the semiconductor industry approaches a wall, and it takes the best minds in the world to figure out whether to go left, right, below, above or through it. As an industry we faced that at 1 micron, and again at 45nm with lithography. Now we are approaching another wall. Complexity has exploded—hardware, software, IP and process technologies—while the entire time-to-market cy... » read more

Everything Changes At 45nm

By Ed Sperling - 20 Mar, 2009 - Comments: 0

Design engineers are pretty good about sharing ideas with their colleagues. They’re extremely good about sharing the limelight with their peers. But they’re not particularly good about implementing new ideas and concepts and changing the way they work. There are good reasons for this, of course. It takes a long time to become proficient at skills for designing new chips or creating a... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: 45nm

Manufacturing Constraint Fears Grow

Resurrecting The Semiconductor Industry

Everything Changes At 45nm