Revolutionizing High-Performance Silicon With Next-Gen Chiplets

By Shivi Arora - 31 Oct, 2024 - Comments: 0

By Shivi Arora and Sue Hung Fung As 5G wireless communications systems continue to be deployed, enterprises are busy planning for 6G—the next generation of wireless communications set to transform our lives. Poised to merge communication and computing, 6G promises to create a hyperconnected world that blends digital and physical experiences with ultra-fast speeds and low latency as a start... » read more

Signals In The Noise: Tackling High-Frequency IC Test

By Gregory Haley - 15 Oct, 2024 - Comments: 0

The need for high-frequency semiconductor devices is surging, fueled by growing demand for advanced telecommunications, faster sensors, and increasingly autonomous vehicles. The advent of millimeter-wave communication in 5G and 6G is pushing manufacturers to develop chips capable of handling frequencies that were once considered out of reach. However, while these technologies promise faster ... » read more

Flip-Chip Bonding Technique To Excite LN Resonators Via Noncontact Electrodes (Yale)

By Technical Paper Link - 09 Sep, 2024 - Comments: 0

A new technical paper titled "Noncontact excitation of multi-GHz lithium niobate electromechanical resonators" was published by researchers at Yale University. Abstract "The demand for high-performance electromechanical resonators is ever-growing across diverse applications, ranging from sensing and time-keeping to advanced communication devices. Among the electromechanical materials being ... » read more

6G And Beyond: Overall Vision And Survey of Research

By Technical Paper Link - 16 Jul, 2024 - Comments: 0

A new 92 page technical paper titled "6G: The Intelligent Network of Everything -- A Comprehensive Vision, Survey, and Tutorial" was published by IEEE researchers at Finland's University of Oulu. Abstract "The global 6G vision has taken its shape after years of international research and development efforts. This work culminated in ITU-R's Recommendation on "IMT-2030 Framework". While the d... » read more

Embracing The Future: 5G NTN – Satellite Service For The Masses

By Allison Freedman - 30 May, 2024 - Comments: 0

In a world where communication is paramount, access to reliable networks is not just a luxury but a necessity. Traditionally, satellite communications have been reserved for specialized terminals with cumbersome antennas and costly subscription plans. However, with the advent of 5G Non-Terrestrial Networks (NTNs), the landscape of satellite phone availability is undergoing a revolutionary tran... » read more

RF General-Purpose Photonic Processor

By Technical Paper Link - 17 Apr, 2024 - Comments: 0

A new technical paper titled "General-purpose programmable photonic processor for advanced radiofrequency applications" was published by researchers at Universitat Politècnica de València and iPronics. Abstract "A general-purpose photonic processor can be built integrating a silicon photonic programmable core in a technology stack comprising an electronic monitoring and controlling layer ... » read more

Reaching For The Stars: Embracing Non-Terrestrial Networks In The Age Of 5G And Beyond

By Alejandro Escobar Calderon - 12 Mar, 2024 - Comments: 0

In the realm of modern connectivity, the race towards faster, more reliable networks has been relentless. With the advent of 5G technology, humanity is on the brink of a new era of communication, promising unprecedented speeds and capabilities. However, as we stand on the precipice of this digital revolution, it's imperative to look beyond the terrestrial confines that have defined our networks... » read more

CMOS-Compatible, On-Chip, Compact And Wideband Nanoacoustic Pass-Band Filters For 5G And 6G

By Technical Paper Link - 22 Feb, 2024 - Comments: 0

A technical paper titled “Compact and wideband nanoacoustic pass-band filters for future 5G and 6G cellular radios” was published by researchers at Northeastern University. Abstract: "Over recent years, the surge in mobile communication has deepened global connectivity. With escalating demands for faster data rates, the push for higher carrier frequencies intensifies. The 7–20 GHz ran... » read more

Bridging The Connectivity Gap: Unraveling The Complexities Of Wireless Standard Deployments

By Alejandro Escobar Calderon - 08 Feb, 2024 - Comments: 0

By Alejandro Escobar Calderon and John Ye In the fast-paced world of technological evolution, the deployment of wireless standards has been touted as the gateway to a connected future. The promise of lightning-fast wireless connectivity has been a driving force behind the relentless pursuit of cutting-edge standards such as 4G, 5G, and new network architectures like Open RAN (O-RAN). However... » read more

Wireless Trend Predictions For 2024 And Their Impact On The Test And Measurement Industry

By Niklas Nolemo - 09 Jan, 2024 - Comments: 0

The ever-evolving landscape of wireless technology continues to shape how we connect, communicate, and innovate. Connected systems continue to grow in complexity and reliance on one another which will impact the test & measurement industry significantly. As we step into the year 2024, several key wireless trends are set to dominate the industry, ushering in a new era of connectivity and r... » read more

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Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?