4 Tips For 5G New Radio Signal Creation

By Keysight - 27 Apr, 2022 - Comments: 0

5G NR requires you to think differently about how you design and test devices. Learn the four tips to help you successfully generate 5G NR test signals to get your designs to market faster. Click here to read more. » read more

5G Brings New Testing Challenges

By Bryon Moyer - 11 Aug, 2020 - Comments: 0

As 5G nears commercial reality, makers of chips and systems that will support 5G will need to take on the standard burden of characterizing and testing their systems to ensure both performance and regulatory adherence. Millimeter-wave (mmWave) and beamforming capabilities present the biggest testing challenges. “5G is expected to have the extended coverage plus the bandwidth to harness ... » read more

5G Drives New Test Approaches

By Kevin Fogarty - 11 Jun, 2019 - Comments: 0

Test/validation providers are claiming steady progress in the race to deliver 5G network components that support millimeter-wave as well as lower-frequency networks. Going from a state of no existing off-the-shelf test equipment suitable for 5G standalone new radio (NR), test companies are introducing equipment that can handle mmWave component testing on a limited scale. 5G is a next-generat... » read more

Betting Big On Discontinuity

By Ed Sperling - 27 Sep, 2018 - Comments: 0

Wally Rhines, president and CEO of Mentor, a Siemens Business, sat down with Semiconductor Engineering to talk about the booming chip industry, what's driving it, how long it will last and what changes are ahead in EDA and chip architectures. What follows are excerpts of that conversation. SE: The EDA and semiconductor industries are doing well right now. What's driving that growth? Rhine... » read more

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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: 5G test

4 Tips For 5G New Radio Signal Creation

5G Brings New Testing Challenges

5G Drives New Test Approaches

Betting Big On Discontinuity