Design of Phased-Array Antennas for MIMO & Beam-Steering Applications


This white paper explores basic phased-array theory and the design considerations behind next-generation antenna systems. It examines the new capabilities recently added to the NI AWR Design Environment platform for developing the RF front-end hardware supporting these new antenna systems, which must be optimized for performance, reliability, compactness, and cost. Click here to read more. » read more

Miles Wide And High Security


Talk about security in autonomous vehicles seems to have subsided. It shouldn't, because the problem is far from solved. In fact, it's not just one problem. It's layers upon layers of problems spread out across all roadways, technology design houses, IP developers, network infrastructure, and the entire supply chain. And even though one vehicle's security may be bulletproof, it may be no... » read more

Designing Networking Chips


Susheel Tadikonda, vice president of networking and storage at Synopsys, talks about what’s changed in the way networking chips are being designed to deal with a massive increase in data. One of those shifts involves software-defined networking, where the greatest complexity resides in the software. That also has a big impact on the entire design flow, from pre-silicon to post-silicon. htt... » read more

Issues In Designing 5G Beamforming Antennas


As 5G networking inches closer to reality, one of the more stubborn problems also will be one of the smallest. Several issues have yet to be cracked with beamforming and massive MIMO antennas, which will make millimeter wave (mmWave) spectrum—a key ingredient in 5G networks—work on multiple devices and base-station locations. Millimeter wave is problematic yet promising. Between bands 30... » read more

The Race To Multi-Domain SoCs


K. Charles Janac, president and CEO of Arteris IP, sat down with Semiconductor Engineering to discuss the impact of automotive and AI on chip design. What follows are excerpts of that conversation. SE: What do you see as the biggest changes over the next 12 to 24 months? Janac: There are segments of the semiconductor market that are shrinking, such as DTV and simple IoT. Others are going ... » read more

Week in Review: IoT, Security, Auto


Internet of Things Pepper IoT collaborated with the Dark Cubed cybersecurity firm to produce “The State of IoT Security Report,” which can be downloaded here. Pepper IoT is an Internet of Things platform and service provider. Key findings of the report: Device security is important, but the platform is much more critical; patching will not fix systemic problems; and the market must make se... » read more

Can AI, 5G Chips Be Verified?


AI and 5G bode well for the semiconductor industry. They will require many billions of new, semi-customized and highly complex chips from the edge all the way to the data center, and they will require massive amounts of engineering time and tooling. But these technologies also are raising lots of questions on the design and verification front about what else can be automated and how to do it. ... » read more

Blog Review: Jan. 30


Cadence's Paul McLellan provides a primer on embedded memory types, their tradeoffs, and the emerging technologies to keep an eye on. Mentor's Matthew Ballance takes a look at how Portable Stimulus can help create better virtual sequences. Synopsys' Taylor Armerding takes a look at what the next year holds for open source, from changes in license terms to the impact of GDPR and a broader ... » read more

Week in Review: IoT, Security, Auto


Internet of Things Tony Franklin, Intel’s general manager for Internet of Things Segments, is interviewed by Lorin Fries on how the chipmaker is helping to develop smart farming applications. “We focus primarily on high-performance computer technologies, as well as communication technologies, which have great applicability for food systems. We work closely with a broad ecosystem of partner... » read more

Planning For 5G And The Edge


Semiconductor Engineering sat down to discuss 5G and edge computing with Rahul Goyal, vice president in the technology and manufacturing group at Intel; John Lee, vice president and general manager of the semiconductor business unit at ANSYS; Rob Aitken, R&D fellow at Arm; and Lluis Paris, director of IP portfolio marketing at TSMC. What follows are excerpts of that conversation. Part one i... » read more

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