Choosing The Right Interconnect


Efforts to zero in on cheaper advanced packaging approaches that can speed time to market are being sidetracked by a dizzying number of choices. At the center of this frenzy of activity is the [getkc id="36" kc_name="interconnect"]. Current options range from organic, silicon and glass interposers, to bridges that span different die at multiple levels. There also are various fan-out approach... » read more

Wireless Test Faces New Challenges


Your mobile phone is far more complex than it was even five years ago, and it’s about to become even more complex with new wireless technologies. That has set off a scramble among test equipment vendors to come up with solutions, methodologies and equipment that is affordable, effective and reliable enough to make sure all of this technology works as planned—and that it continues to work th... » read more

The Week In Review: Manufacturing


Trade President Trump this week announced his decisions on the actions the administration will take in response to China’s alleged unfair trade practices covered in the USTR Section 301 investigation of “China’s Acts, Policies, and Practices Related to Technology Transfer, Intellectual Property, and Innovation.” Trump has proposed import tariffs that amount to about $60 billion on pro... » read more

The Week in Review: IoT


Finance Bestmile, which offers a mobility platform for managing autonomous vehicle fleets, raised $11 million in Series A funding led by Road Ventures SA. Also participating in the round are Partech Ventures, Groupe ADP, Airbus Ventures, Serena Capital, and MobilityFund. The startup, incorporated in 2014, will use the money for worldwide expansion, strengthening its cloud-based mobility platfo... » read more

The Bumpy Road To 5G


5G is coming, but not everywhere, not all at once, and not the fastest version of this technology right away. In fact, the probable scenario is that 5G will be rolled out first in densely populated urban areas, starting in 2020 or 2021, with increasingly widespread adoption over the next decade after that. But 5G is unlikely to ever completely replace 4G LTE, just as a smart phone today roll... » read more

Mixing 4G And 5G


5G networks will impact the number and types of ICs in end-user devices and the base stations used to transmit the signals (including the repeaters that rebroadcast those signals). And this is before we begin to consider the technology impact to the infrastructure required to support the data generated in a 5G ecosystem (servers, memory and so on). First, 5G is expected to transmit up to 10 ... » read more

New Applications, Multiple Approaches


It may be tempting to view the strong demand for semiconductors as just one more up-cycle in our traditionally cyclical industry, but what’s really driving things right now is the opening of entirely new horizons, made possible by the increased capabilities of today’s chips. Chip demand is no longer only being driven by the needs of computer and smartphone manufacturers. Now, a mushroomi... » read more

The Week in Review: IoT


Finance Toronto-based Ecobee, which markets smart thermostats, raised $61 million in its Series C funding, bringing the total funding for the 11-year-old company to $146 million. Energy Impact Partners led the new round and was joined by Amazon’s Alexa Fund, Relay Ventures, and Thomvest. Ecobee counts Nest Labs, the Google subsidiary, as its chief rival. ThoughtWire, also headquartered in... » read more

5G New Radio Signal Design


By Gent Paparisto, Joel Kirshman, and David Vye The CP-OFDM modulation scheme will have many options. Variable subcarrier spacing (SCS) will be 3.75, 15, 30, 60, 120, 240, 480 kHz with sub-1 GHz of 15 and 30 kHz and sub-6 GHz of 15, 30, and 60 kHz, and above 6 GHz of 60 and 120 kHz. There will be normal and extended CP options. Slot duration will be 0.5 ms, subframe curation will be 1 ms, an... » read more

Toward High-End Fan-Outs


Foundries and OSATs are working on more advanced fan-outs, including some with vertically stacked die inside the package, filling a middle ground between lower-cost fan-outs and systems in package on one side and 2.5D and 3D-ICs on the other. These new [getkc id="202" kc_name="fan-outs"] have denser interconnects than previous iterations, and in some cases they include multiple routing layer... » read more

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