tag: AI

Novel Assembly Approaches For 3D Device Stacks
By Laura Peters - 30 Jun, 2025 - Comments: 0

The next big leap in semiconductor packaging will require a slew of new technologies, processes, and materials, but collectively they will enable orders of magnitude improvement in performance that will be essential for the AI age. Not all of these issues are fully solved but the recent Electronic Components Technology Conference (ECTC) provided a glimpse into the huge leaps in progress that... » read more

Iteration And Hallucination
By Brian Bailey - 26 Jun, 2025 - Comments: 0

Iteration loops have been a vital aspect of EDA flows for decades. Ever since gate delays and wire delays became comparable, it became necessary to find out if the result of a given logic synthesis run would yield acceptable timing. Over the years this problem became worse because one decision can affect many others. The ramifications of a decision may not have been obvious to an individual too... » read more

Mixed Messages Complicate Mixed-Signal
By Brian Bailey - 26 Jun, 2025 - Comments: 0

Several years ago, analog and mixed signal (AMS) content hit a wall. Its contribution to first-time chip failure doubled, and there is no evidence that anything has improved dramatically since then. Some see that the problem is likely to get worse due to issues associated with advanced nodes, while others see hope for improvement coming from AI or chiplets. Fig. 1: Cause of ASIC respins. S... » read more

Redefining SoC Design: The Shift To Secure Chiplet-Based Architectures
By Moshiko Emmer - 26 Jun, 2025 - Comments: 0

The semiconductor industry is undergoing a paradigm shift from monolithic system-on-chip (SoC) architectures to modular, chiplet-based designs. This transformation is driven by escalating design complexity, soaring fabrication costs, and the relentless pursuit of efficiency. However, as chiplet adoption accelerates, security becomes a critical concern, requiring robust measures to protect data,... » read more

EDA’s Top Execs Map Out An AI-Driven Future
By Ed Sperling - 23 Jun, 2025 - Comments: 0

Artificial intelligence is permeating the entire semiconductor ecosystem, forcing fundamental changes in AI chips, the design tools used to create them, and the methodologies used to ensure they will work reliably. This is a global race that will redefine nearly every domain over the next decade. In presentations and interviews over the past several months, top EDA executives converged on th... » read more

Power Delivery Challenges For AI Chips
By Gregory Haley - 19 Jun, 2025 - Comments: 0

As artificial intelligence (AI) workloads grow larger and more complex, the various processing elements being developed to process all that data are demanding unprecedented levels of power. But delivering this power efficiently and reliably, without degrading signal integrity or introducing thermal bottlenecks, has created some of the toughest design and manufacturing challenges in semiconducto... » read more

Can You Build A Known-Good Multi-Die System?
By Ed Sperling - 18 Jun, 2025 - Comments: 0

Semiconductor Engineering sat down to discuss the challenges of designing and testing multi-die systems, including how to ensure they will work as expected, with Bill Mullen, Ansys fellow; John Ferguson, senior director of product management at Siemens EDA; Chris Mueth, senior director of new markets and strategic initiatives at Keysight; Albert Zeng, senior engineering group director at Cadenc... » read more

The Coming NPU Population Collapse
By Steve Roddy - 12 Jun, 2025 - Comments: 0

At some point in everyone’s teenage years of schooling we were all taught in a nature or biology class about cycles of population surges and then inevitable population collapses. Whether the example was an animal, plant, insect or even bacteria, some external event triggers a rapid surge in the population of a species which leads to overpopulation and competition for resources (food, space, s... » read more

The Best DRAMs For Artificial Intelligence
By Bryon Moyer - 12 Jun, 2025 - Comments: 0

Artificial intelligence (AI) involves intense computing and tons of data. The computing may be performed by CPUs, GPUs, or dedicated accelerators, and while the data travels through DRAM on its way to the processor, the best DRAM type for this purpose depends on the type of system that is performing the training or inference. The memory challenge facing engineering teams today is how to keep... » read more

The Data Dilemma In Semiconductor Testing And Why It Matters: Part 1
By Roberto Colecchia - 10 Jun, 2025 - Comments: 0

In today’s semiconductor industry, machine learning (ML) is no longer a buzzword — it’s an operational necessity. From optimizing test flows to identifying device drifts and executing advanced analytics like VMIN or trimming, ML-based applications are increasingly used to boost yields, improve quality, and lower test costs. But there’s a catch. To make these intelligent applications ... » read more

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