Blog Review: Dec. 18


Siemens’ Michael Munsey predicts that the convergence of AI, advanced packaging, and rise of software-defined products aren’t just incremental changes but will represent a fundamental shift in how we think about semiconductor design and manufacturing. Cadence's Veena Parthan points to hex-core voxels as a significant leap forward for the CFD meshing process that blends the best of struct... » read more

Chiplet Interconnects Add Power And Signal Integrity Issues


The flexibility and scalability offered by chiplets make them an increasingly attractive choice over planar SoCs, but the rollout of increasingly heterogeneous assemblies adds a variety of new challenges around the processing and movement of data. Nearly all of the chiplets in use today were designed in-house by large systems companies and IDMs. Going forward, third-party chiplets will begin... » read more

Where Is The Software For Shift Left?


Co-development of hardware and software has been a dream for a long time, but significant hurdles remain. Neither domain is ready with what the other requires at the appropriate time. The earlier something can be done in a development flow, the less likely problems will be found when they are more difficult or expensive to fix. It may require both tool and methodology changes, so that a proc... » read more

The Future Of AI For Games


Earlier this month, I had the pleasure of attending the inaugural AI and Games Conference at Goldsmiths in London, for which Arm was an associate sponsor. Hosted by Dr. Tommy Thompson, and borrowing its name from his AI and Games YouTube channel, the day really delivered on the promise of bringing experts and enthusiasts (and subscribers) together for interesting talks on the intersecti... » read more

Deploying Generative AI At Scale With Flexibility And Speed


As the types of content that generative AI (GenAI) can process expands to advanced video, images, audio, and text, the race to innovate is creating new hurdles for developers. Discover how to overcome the challenges surrounding scalability and speed of GenAI development to offer cutting-edge experiences. Read more here and learn: How to run and scale GenAI workloads efficiently. Tech... » read more

Chip Industry Week In Review


Global chips sales hit a record $56.9 billion in October, a 22% increase versus October 2023, according to the Semiconductor Industry Association. Also, global semiconductor equipment billings reached $30.38 billion in Q3 2024, a 19% YoY increase and 13% growth QoQ, SEMI reported. TSMC commenced equipment installation for its 2nm fab in Kaohsiung, Taiwan, six months ahead of schedule. The 2n... » read more

Radar, AI, And Increasing Autonomy Are Redefining Auto IC Designs


Increasing levels of autonomy in vehicles are fundamentally changing which technologies are chosen, how they are used and interact with each other, and how they will evolve throughout a vehicle's lifetime. Entire vehicle architectures are being reshaped continuously to enable the application of AI across a broad swath of functions, prompting increasing investment into technologies that were ... » read more

Blog Review: Dec. 4


Siemens' Reetika explains how creating and verifying a complete reset tree structure allows designers to trace the flow of reset signals across the design and ensure that every sequential element is tagged correctly within its respective reset domain. Cadence's Durlov Khan suggests DDR5 DIMM Memory Models and Discrete Component Models as part of a flexible approach to validating specific com... » read more

Chip Companies Play Bigger Role In Shaping University Curricula


A shortage of senior engineers with the necessary skills and experience is forcing companies to hire and train fresh graduates, a more time-consuming process but one that allows them to rise through the ranks using the companies' preferred technology and systems. Universities and companies share the goal of helping a graduate become productive in the workplace as quickly as possible, and the... » read more

Top-Down Vs. Bottom-Up Chiplet Design


Chiplets are gaining widespread attention across the semiconductor industry, but for this approach to really take off commercially it will require more standards, better modeling technologies and methodologies, and a hefty amount of investment and experimentation. The case for chiplets is well understood. They can speed up time to market with consistent results, at whatever process node work... » read more

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