tag: ARM

Blog Review: May 27
By Jesse Allen - 27 May, 2026 - Comments: 0

Cadence's Igor Krause explains Precision Time Measurement (PTM), a PCIe feature that enables precise coordination of events across multiple components with independent local time clocks. Siemens' John McMillan suggests the way to achieve trusted traceability across the semiconductor supply chain is by implementing a blockchain-based distributed ledger paired with a secure digital twin. Sy... » read more

Blog Review: May 20
By Jesse Allen - 20 May, 2026 - Comments: 0

Cadence's Siddh Virani demonstrates how to import and integrate foreign language logic into PSS on both Target and Solve platforms, opening possibilities for code reuse and cross-language collaboration. Synopsys' Sumit Vishwakarma finds that AI model training and inference workloads are forcing the industry to rethink not only how much compute fits in a rack, but how servers are architected ... » read more

Chip Industry Week in Review
By The SE Staff - 15 May, 2026 - Comments: 0

Global The U.S. created a licensing path for Nvidia H200 shipments in January and has since approved sales to 10 Chinese companies, but so far no shipments have been confirmed, reports Reuters. With a looming end-of-year expiration, SIA, SEMI, and other business groups are urging Congress to extend the US semiconductor tax credit and expand it to cover semiconductor design and other act... » read more

Introducing “The Architecture Speaks”
By Jade Alglave - 14 May, 2026 - Comments: 0

What are specifications used for? How do you use them? Are they intelligible? These questions are at the heart of the project that produces a new tool called "The Architecture Speaks". This is an experimental chatbot tool built on generative AI that aims to provide quick answers to complex questions about the Arm architecture. It also provides links to the Arm Architecture Reference Manual. Th... » read more

Blog Review: May 13
By Jesse Allen - 13 May, 2026 - Comments: 0

Siemens' Loay Hegazy, Mohamed Taher, and Sherif Hammouda describe a GPU rasterizer designed specifically for computational lithography and present benchmark results and practical implications for mask synthesis workflows. Cadence's Udaya Shankar introduces RTL, logic, and physical restructuring techniques and how they can help improve PPA, reduce dynamic power consumption, and optimize place... » read more

Chip Industry Week In Review
By The SE Staff - 08 May, 2026 - Comments: 0

Manufacturing ASE and WUS are jointly building a ~$1.1B advanced packaging hub in Kaohsiung, Taiwan, for fan-out chip-on-substrate (FOCoS) and flip-chip ball grid array (FC BGA) technologies. The new site is expected to be completed by September 2029. SpaceX filed documents for a “Terafab” semiconductor manufacturing and computing facility at Gibbons Creek Reservoir in Texas, with a... » read more

Blog Review: May 6
By Jesse Allen - 06 May, 2026 - Comments: 0

Synopsys' Prith Banerjee identifies key challenges in designing AI data centers and why addressing them requires a transformative approach that impacts every aspect of the system design and its individual components. Cadence's Meet S Chauhan checks out what's new in MIPI C-PHY v3.0, including the new 18 wire state mode that can support high-resolution display and image sensors and motion vec... » read more

Designing Chips In The Context Of Rapidly Evolving AI
By Ann Mutschler - 04 May, 2026 - Comments: 0

Key Takeaways: Agentic edge AI drives long-lived, tool-mediated loops with variable demands for compute, tokens, and memory. Edge PPA is dominated by memory hierarchy and data movement, forcing tight feature triage and robust RAS. Rapid model churn (multimodal, MoE, new formats) requires programmable, headroom-rich compute, interconnect, and runtime. Experts At The Table: Ch... » read more

Chip Industry Week in Review
By The SE Staff - 01 May, 2026 - Comments: 0

Advanced nodes and capacity The US Commerce Dept. told IC equipment makers to stop shipments to Hua Hong Group, China's No. 2 chipmaker, in order to protect America's lead, according to Reuters. Global AI competition is causing wafer and packaging shortages, but capacity increases are expected to come online later this year and in 2027 to ease the crunch, according to TrendForce. Leadi... » read more

From Standards To Systems: The Chiplet Era On Arm
By Nandan Nayampally - 30 Apr, 2026 - Comments: 0

For three decades, Arm didn’t just participate in industry transformation — it redefined it. From mobile to cloud to automotive, Arm’s architecture and the AMBA ecosystem have become the backbone of scalable compute. Now the industry faces its next structural shift: The era of monolithic SoCs is tapering and giving way to the era of chiplet systems. While complex SoCs are going to b... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy