2nm; 14A accelerates; memory deal; optimizing EUV output; KGD screening; McKinsey’s auto chips report; HW security exploits; humanoids; H-1B policy; diamonds for heat; Europe’s IC progress; imec’s latest; quantum HW progress towards fault-tolerance.
Global |In-Depth |Reports and Deals | New Technologies | Security | Vehicles, Batteries |Trending Video | Research | Quantum | Workforce, Education Events and Webinars
Semiconductor Engineering published two newsletters this week, including one special report and five other in-depth articles:
Test, Measurement and Analytics:
Plus:
Si2 released AI for EDA Ontology, which provides an example ontology, plus use cases, to enable EDA agentic system experimentation.
Arm and Sumo Digital made a mobile game to showcase GPU neural graphics technology.
Imec introduced a narrowband receiver chip that is compliant with the IEEE 802.15.4ab UWB standard. The research house also announced that it is laser-bonding III-V chiplets on RF silicon interposers.
Qnity Electronics added multi-role copper and dry film photo-imageable dielectric material solutions for organic interposer applications. Qnity also released CMP pads with improved defect control and extended lifetime.
Lotus Microsystems uncorked a vertical power delivery and thermal management platform for AI accelerators that sits beneath the processor.
Innosilicon debuted UALink IP with a single-lane 112G/224G PHY.
Harry Levinson of HJL Lithography looked at how photomasks became critical to the chip industry, tracing lithography’s evolution and explaining why today’s mask-making must be nearly flawless.
Sony Semiconductor will offer an X-ray CMOS image sensor for inspection and measurement, claiming a maximum 26,100 fps high-speed imaging and low noise.
U. of Osaka researchers used simulations to optimize tin-plasma EUV lithography sources, finding that mid-infrared solid-state lasers could improve conversion efficiency and help make future EUV systems smaller and more efficient.
A Georgia Tech-led research team showed that oxide-channel FeFETs can survive annealing up to 650°C (1,202°F), an important step toward eNVM compatibility with 3D NAND manufacturing.
Caltech showed off stretchable bioelectronics, which use liquid-metal conductors, carbon nanotube electrodes, and printable sensor platforms to maintain stable electrical and electrochemical performance on moving skin and organs.
MIT-led researchers integrated GaN dielets into a single-crystal diamond interposer amplifier and found “the diamond acts as a heat spreader that normalizes the temperature and allows the transistors to approach peak performance without reducing reliability.”
DARPA’s THREADS program demonstrated a ~5x increase in RF system power density, which could roughly double radar range.
ETH Zurich researchers said they exploited a vulnerability in AMD’s confidential computing for a third time, suggesting hardware interconnects are an attack surface that needs more attention.
Lumen’s Black Lotus Labs reported a resurgence of the JDY botnet, a China-linked network of compromised small/home office routers and IoT devices used to scan, fingerprint, and map exposed services for rapid follow-on exploitation.
UofM’s Todd Austin is making his Simon cipher library open source, including SystemVerilog implementations of the Simon Cipher, plus a test suite and fuzzer.
ETH Zurich, CISPA, and Inria presented a “new DRAM access pattern that can amplify DRAM read disturbance by asymmetrically extending the open time of two aggressor rows. “
Check Point warned that attackers are actively exploiting CVE-2026-50751, a critical VPN authentication-bypass flaw affecting certain Remote Access VPN, Mobile Access, and Spark Firewall deployments.
Microsoft issued a bunch of June security updates, including Windows Secure Boot, UEFI, BitLocker, Hyper-V, Bluetooth, and kernel components.
CISA shortened remediation deadlines by federal agencies for the most critical vulnerabilities to three days, citing concerns that AI is accelerating the speed at which attackers can exploit newly disclosed flaws.
Fig. 1: CISA’s remediation timelines
Find all of the latest CISA alerts here, including an update for the Cisco Catalyst SD-WAN.
1 Megawatt Racks In Data Centers: A look inside the next-generation AI server rack.
The demand for performance in an AI data center is causing a huge spike in the amount of power being consumed. This tech talk looks at the unprecedented changes underway to enable faster training and inferencing, and the collection of new technologies needed to make this all work, from 3.5D and 3D-ICs to the disaggregation of memory into tiered structures.
U. of Florida is now offering a Preparing the Autistic Population Toward Hardware Security (PATHS) program, offering hands‑on training, resume help, and one-on-one mentorships for neurodivergent students, with a goal of eventually offering full-time roles in the IC industry.
H-1B policy is becoming a major battleground for U.S. talent, innovation, universities and technology competitiveness. Hoover Institution‘s high-skilled immigration briefing argues that tighter H-1B and student-visa rules risk pushing AI, STEM, and startup talent overseas. Also this week, a federal court ruling struck down the Trump administration’s $100K fee on new H-1B petitions, calling it an unlawful tax.
Siemens and ABB are leading a Careers Electric Coalition to scale the US electric workforce development.
Meta is launching America’s Workforce Academy, a $115M free training program for AI data center jobs.
Alice & Bob introduced its first complete quantum computing system, which is upgradable and can create a logical qubit from as few as 18 physical qubits. It also proposed a framework to benchmark logical qubits and evaluate performance across hardware modalities.
SQC received an additional ~$28M for high-precision silicon quantum chip.
IQM proposed a quantum error-correcting code that it says lowers logical error rates while requiring fewer physical qubits.
Upcoming webinars are here, including:
Find upcoming chip industry events here, including:
| EVENTS | Date | Location |
|---|---|---|
| IEEE/JSAP Symposium on VLSI Technology and Circuits | June 14 – 18 | Honolulu + Virtual |
| Siemens EDA IC Forum Europe | June 16- 17 | Dresden June 16; Eindhoven June 17 |
| Automotive Electronics Congress | June 16 – 17 | Ludwigsburg, Germany |
| 3D & Systems Summit | June 17 – 19 | Dresden, Germany |
| Scaling DRAM Technology to Meet Future Demands: System Challenges and Opportunities | June 27 | Raleigh, North Carolina |
| International Symposium on Computer Architecture (ISCA) | June 27 – Jul 1 | Raleigh, North Carolina |
| ALD/ALE 2026: Atomic Layer Deposition and Atomic Layer Etching | June 28 – Jul 1 | Tampa, Florida |
| International Conference on Synthesis, Modeling, Analysis and Simulation Methods, and Applications to Circuit Design (SMACD) | June 29 – Jul 2 | Dresden, Germany |
| SEMI Advanced Packaging Summit | Jul 15 | South Korea |
| ITC India: International Test Conference | Jul 19 – 21 | BENGALURU |
| The Chips to Systems Conference (DAC) | Jul 26 – 29 | Long Beach, CA |
| Find all events here. |
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