Chip Industry Week In Review


By Jesse Allen, Gregory Haley, and Liz Allan Intel officially launched Intel Foundry this week, claiming it's the "world's first systems foundry for the AI era." The foundry also showed off a more detailed technology roadmap down to expanded 14A process technology. Intel CEO Pat Gelsinger noted the foundry will be separate from the chipmaker, utilize third-party chiplets and IP, and leverage... » read more

Chip Industry Week In Review


By Jesse Allen, Gregory Haley, and Liz Allan. Cadence introduced an AI-based thermal stress and analysis platform aimed at 2.5D and 3D-ICs, and cooling for PCBs and electronic assemblies. The company also debuted a HW/SW accelerated digital twin solution for multi-physics system design and analysis, combining GPU-resident computational fluid dynamics (CFD) solvers with dedicated GPU hardwar... » read more

A Chiplet-Based Fully Homomorphic Encryption Accelerator


A technical paper titled “CiFHER: A Chiplet-Based FHE Accelerator with a Resizable Structure” was published by researchers at Seoul National University. Abstract: "Fully homomorphic encryption (FHE) is in the spotlight as a definitive solution for privacy, but the high computational overhead of FHE poses a challenge to its practical adoption. Although prior studies have attempted to desig... » read more

Week In Review: Design, Low Power


Apple plans to spend an additional €1 billion (~$1.1B) over the next six years to expand its Munich, Germany-based Silicon Design Centre, including the construction of a new research facility. "The expansion of our European Silicon Design Centre will enable an even closer collaboration between our more than 2,000 engineers in Bavaria working on breakthrough innovations, including custom sil... » read more

Week In Review: Semiconductor Manufacturing, Test


Chinese memory chip maker YMTC and dozens of other Chinese entities are "at risk" of being added to a trade blacklist as soon as Dec. 6, a U.S. Commerce Department official said in prepared remarks seen by Reuters. SMIC co-CEO Zhao Haijun said on an earnings call that recent export controls from the United States will have an "adverse impact" on the company's production. The U.K. has rule... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive Renesas announced its integrated development environment (IDE), which car companies can use to develop automotive software for electronic control units (ECUs) with multiple devices, but for which the hardware has not been specified yet. The IDE has co-simulation, debug and trace, high-speed simulation and distributed processing software over multiple SoCs and MCUs. The first develop... » read more

Manufacturing Bits: Jan. 7


Beyond 5G chips At the recent IEEE International Electron Devices Meeting (IEDM), NTT and the Tokyo Institute of Technology presented a paper on a technology that could enable high-speed wireless devices beyond the 5G standard. Researchers have devised a 300GHz wireless transceiver (TRx) that supports a data rate of more than 100Gb/s. The device is based on a technology called indium phosph... » read more

Manufacturing Bits: May 8


Electrolyte transistors Delft University of Technology, the Centre National de la Recherche Scientifique (CNRS) and NTT have developed a nanotransistor technology that will make it easier to measure the concentration of different electrolytes in the body. Electrolytes involve nutrients and chemicals in the body. They perform important functions and a disruption of the electrolyte balance is... » read more

Processing Moves To The Edge


Edge computing is evolving from a relatively obscure concept into an increasingly complex component of a distributed computing architecture, in which processing is being shifted toward end devices and satellite data facilities and away from the cloud. Edge computing has gained attention in two main areas. One is the [getkc id="78" kc_name="industrial IoT"], where it serves as a do-it-yoursel... » read more

Manufacturing Bits: Aug. 2


CMP replacement? For years, chipmakers have used chemical-mechanical-polishing (CMP) tools to smooth or polish the surface of a wafer. CMP works, but the technology is time-consuming and expensive. CMP can also leave unwanted residual patterns and defects near the surface. In response, Russia’s National Research Nuclear University MEPhI (Moscow Engineering Physics Institute) has help... » read more

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