Chip Industry Week In Review

By The SE Staff - 12 Apr, 2024 - Comments: 0

Applied Materials may scale back or cancel its $4 billion new Silicon Valley R&D facility in light of the U.S. government's recent announcement to reduce funding for construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States, according to the San Francisco Chronicle. TSMC could receive up to $6.6 billion in direct funding... » read more

Chip Industry Week In Review

By The SE Staff - 01 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan. India approved the construction of two fabs and a packaging house, for a total investment of about $15.2 billion, according to multiple sources. One fab will be jointly owned by Tata and Taiwan's Powerchip. The second fab will be a joint investment between CG Power, Japan's Renesas Electronics, and Thailand's Stars Microelectronics. Tata will run t... » read more

Chip Industry Week In Review

By The SE Staff - 23 Feb, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan Intel officially launched Intel Foundry this week, claiming it's the "world's first systems foundry for the AI era." The foundry also showed off a more detailed technology roadmap down to expanded 14A process technology. Intel CEO Pat Gelsinger noted the foundry will be separate from the chipmaker, utilize third-party chiplets and IP, and leverage... » read more

Chip Industry Week In Review

By The SE Staff - 02 Feb, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan. Cadence introduced an AI-based thermal stress and analysis platform aimed at 2.5D and 3D-ICs, and cooling for PCBs and electronic assemblies. The company also debuted a HW/SW accelerated digital twin solution for multi-physics system design and analysis, combining GPU-resident computational fluid dynamics (CFD) solvers with dedicated GPU hardwar... » read more

A Chiplet-Based Fully Homomorphic Encryption Accelerator

By Technical Paper Link - 18 Aug, 2023 - Comments: 0

A technical paper titled “CiFHER: A Chiplet-Based FHE Accelerator with a Resizable Structure” was published by researchers at Seoul National University. Abstract: "Fully homomorphic encryption (FHE) is in the spotlight as a definitive solution for privacy, but the high computational overhead of FHE poses a challenge to its practical adoption. Although prior studies have attempted to desig... » read more

Week In Review: Design, Low Power

By Jesse Allen - 03 Mar, 2023 - Comments: 0

Apple plans to spend an additional €1 billion (~$1.1B) over the next six years to expand its Munich, Germany-based Silicon Design Centre, including the construction of a new research facility. "The expansion of our European Silicon Design Centre will enable an even closer collaboration between our more than 2,000 engineers in Bavaria working on breakthrough innovations, including custom sil... » read more

Week In Review: Semiconductor Manufacturing, Test

By Karen Heyman - 18 Nov, 2022 - Comments: 0

Chinese memory chip maker YMTC and dozens of other Chinese entities are "at risk" of being added to a trade blacklist as soon as Dec. 6, a U.S. Commerce Department official said in prepared remarks seen by Reuters. SMIC co-CEO Zhao Haijun said on an earnings call that recent export controls from the United States will have an "adverse impact" on the company's production. The U.K. has rule... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 30 Sep, 2022 - Comments: 0

Automotive Renesas announced its integrated development environment (IDE), which car companies can use to develop automotive software for electronic control units (ECUs) with multiple devices, but for which the hardware has not been specified yet. The IDE has co-simulation, debug and trace, high-speed simulation and distributed processing software over multiple SoCs and MCUs. The first develop... » read more

Manufacturing Bits: Jan. 7

By Mark LaPedus - 07 Jan, 2020 - Comments: 0

Beyond 5G chips At the recent IEEE International Electron Devices Meeting (IEDM), NTT and the Tokyo Institute of Technology presented a paper on a technology that could enable high-speed wireless devices beyond the 5G standard. Researchers have devised a 300GHz wireless transceiver (TRx) that supports a data rate of more than 100Gb/s. The device is based on a technology called indium phosph... » read more

Manufacturing Bits: May 8

By Mark LaPedus - 08 May, 2018 - Comments: 0

Electrolyte transistors Delft University of Technology, the Centre National de la Recherche Scientifique (CNRS) and NTT have developed a nanotransistor technology that will make it easier to measure the concentration of different electrolytes in the body. Electrolytes involve nutrients and chemicals in the body. They perform important functions and a disruption of the electrolyte balance is... » read more

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tag: NTT

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

A Chiplet-Based Fully Homomorphic Encryption Accelerator

Week In Review: Design, Low Power

Week In Review: Semiconductor Manufacturing, Test

Week In Review: Auto, Security, Pervasive Computing

Manufacturing Bits: Jan. 7

Manufacturing Bits: May 8

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