Chip Industry Technical Paper Roundup: May 21


New technical papers added to Semiconductor Engineering’s library this week. [table id=227 /] More ReadingTechnical Paper Library home » read more

Tweaking Isotopes In Thin Semiconductor Materials Can Influence Optical And Electronic Properties 


A technical paper titled “Anomalous isotope effect on the optical bandgap in a monolayer transition metal dichalcogenide semiconductor” was published by researchers at Oak Ridge National Laboratory (ORNL) and University of Central Florida. Abstract: "Isotope effects have received increasing attention in materials science and engineering because altering isotopes directly affects phonons, ... » read more

Chip Industry Week In Review


Samsung and Synopsys collaborated on the first production tapeout of a high-performance mobile SoC design, including CPUs and GPUs, using the Synopsys.ai EDA suite on Samsung Foundry's gate-all-around (GAA) process. Samsung plans to begin mass production of 2nm process GAA chips in 2025, reports BusinessKorea. UMC developed the first radio frequency silicon on insulator (RF-SOI)-based 3D IC ... » read more

Maximizing Edge Intelligence Requires More Than Computing


By Toshi Nishida, Avik W. Ghosh, Swaminathan Rajaraman, and Mircea Stan Commercial-off-the-shelf (COTS) components have enabled a commodity market for Wi-Fi-connected appliances, consumer products, infrastructure, manufacturing, vehicles, and wearables. However, the vast majority of connected systems today are deployed at the edge of the network, near the end user or end application, opening... » read more

Chip Industry’s Technical Paper Roundup: Jan 3


New technical papers added to Semiconductor Engineering’s library this week. [table id=72 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Multi-Wavelength, Multimode Communication Scheme For On-Chip and Chip-to-Chip Interconnects


A technical paper titled "Multi-dimensional data transmission using inverse-designed silicon photonics and microcombs" was published by researchers at Stanford, Harvard, University of Central Florida, NIST, and others. "Here we demonstrate an integrated multi-dimensional communication scheme that combines wavelength- and mode- multiplexing on a silicon photonic circuit. Using foundry-compati... » read more

Research Bits: Nov. 7


ADC side-channel attacks Researchers at MIT propose two ways to protect analog-to-digital converters (ADCs) from power and electromagnetic side-channel attacks. The researchers first investigated the side-channel attacks that could be used against ADCs. Power attacks usually involve an attacker soldering a resistor onto the device’s circuit board to measure its power usage. An electromagn... » read more

Chip Industry’s Technical Paper Roundup: Nov. 1


New technical papers added to Semiconductor Engineering’s library this week. [table id=61 /] » read more

New Class of Electrically Driven Optical Nonvolatile Memory


A new technical paper titled "Electrical Programmable Multi-Level Non-volatile Photonic Random-Access Memory" was published by researchers at George Washington University, Optelligence, MIT, and the University of Central Florida. Researchers demonstrate "a multi-state electrically-programmed low-loss non-volatile photonic memory based on a broadband transparent phase change material (Ge2Sb2S... » read more

Research Bits: May 9


Optical oscilloscope Researchers from the University of Central Florida developed an optical oscilloscope to measure the electric field of light. The high speed at which light oscillates has made reading its electric field challenging, with current instruments able to resolve an average signal associated with a pulse of light rather than individual peaks and valleys within the pulse. “... » read more

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