Multi-Wavelength, Multimode Communication Scheme For On-Chip and Chip-to-Chip Interconnects


A technical paper titled “Multi-dimensional data transmission using inverse-designed silicon photonics and microcombs” was published by researchers at Stanford, Harvard, University of Central Florida, NIST, and others.

“Here we demonstrate an integrated multi-dimensional communication scheme that combines wavelength- and mode- multiplexing on a silicon photonic circuit. Using foundry-compatible photonic inverse design and spectrally flattened microcombs, we demonstrate a 1.12-Tb/s natively error-free data transmission throughout a silicon nanophotonic waveguide. Furthermore, we implement inverse-designed surface-normal couplers to enable multimode optical transmission between separate silicon chips throughout a multimode-matched fibre,” states the paper.

Find the technical paper here. Published December 2022.

Yang, K.Y., Shirpurkar, C., White, A.D. et al. Multi-dimensional data transmission using inverse-designed silicon photonics and microcombs. Nat Commun 13, 7862 (2022). https://doi.org/10.1038/s41467-022-35446-4.

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