Chip Industry Week In Review

By The SE Staff - 08 Dec, 2023 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan AMD took the covers off new AI accelerators for training and inferencing of large language model and high-performance computing workloads. In its announcement, AMD focused heavily on performance leadership in the commercial AI processor space through a combination of architectural changes, better software efficiency, along with some improvements in... » read more

Security Becomes Much Bigger Issue For AI/ML Chips, Tools

By Lou Covey - 01 Jun, 2023 - Comments: 0

Security is becoming a bigger issue in AI and machine learning chips, in part because the chip industry is racing just to get new devices working, and in part because it's difficult to secure a new technology that is expected to adapt over time. And unlike in the past, when tools and methodologies were relatively fixed, nearly everything is in motion. Algorithms are being changed, EDA tools ... » read more

Chip Industry’s Technical Paper Roundup: Jan 3

By Linda Christensen - 03 Jan, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=72 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Multi-Wavelength, Multimode Communication Scheme For On-Chip and Chip-to-Chip Interconnects

By Technical Paper Link - 02 Jan, 2023 - Comments: 0

A technical paper titled "Multi-dimensional data transmission using inverse-designed silicon photonics and microcombs" was published by researchers at Stanford, Harvard, University of Central Florida, NIST, and others. "Here we demonstrate an integrated multi-dimensional communication scheme that combines wavelength- and mode- multiplexing on a silicon photonic circuit. Using foundry-compati... » read more

Week In Review: Semiconductor Manufacturing, Test

By Karen Heyman - 28 Oct, 2022 - Comments: 0

This week saw more fallout from U.S. export controls: SK hynix may consider selling its memory chip production facilities in China if recently imposed controls make it too difficult to continue operations there, according to Nikkei Asia. "As a contingency plan, we are considering selling the fab, selling the equipment or transferring the equipment to South Korea," said Kevin Noh, SK hynix ... » read more

Week In Review: Semiconductor Manufacturing, Test

By Karen Heyman - 07 Oct, 2022 - Comments: 0

Micron selected Syracuse, New York as the site for its new megafab complex, which is expected to create 9,000 company jobs and 40,000 construction and supply chain jobs. President Biden called it “another win for America.” The chip manufacturing facility will be the nation’s largest, including a 7.2 million square foot complex and 2.4 million square foot of cleanroom. Site preparation wil... » read more

Technical Paper Roundup: Sept 27

By Linda Christensen - 27 Sep, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=53 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

More Efficient On-Chip Laser Frequency Comb (Harvard)

By Technical Paper Link - 15 Sep, 2022 - Comments: 0

A new technical paper titled "High-efficiency and broadband on-chip electro-optic frequency comb generators" was published by researchers at Harvard, Stanford, Caltech, and Hyperlight. The research claims the electro-optic frequency device is 100% more efficient and has 2X the bandwidth of previous technology. According to Harvard's news release, "the latest research applies the two con... » read more

Academic Research Paper Round-Up: April 13

By Linda Christensen - 13 Apr, 2022 - Comments: 0

The volume of research into advanced semiconductors is rising and widening. The latest batch includes hybrid power-gating architecture, RRAM devices models, improved FMEA, quantum machine learning, enhanced nonlinear optics, harvesting energy after sundown, direct chemisorption-assisted nanotransfer printing, and more. Topping the list of researchers this week are ETH Zurich, Stanford Unive... » read more

Electrically pumped laser transmitter integrated on thin-film lithium niobate

By Technical Paper Link - 11 Apr, 2022 - Comments: 0

New research paper from Harvard, in collaboration with Freedom Photonics and HyperLight Corp, and with funding from DARPA and Air Force Office of Scientific Research. Abstract "Integrated thin-film lithium niobate (TFLN) photonics has emerged as a promising platform for the realization of high-performance chip-scale optical systems. Of particular importance are TFLN electro-optic modulato... » read more

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Chip Industry Week In Review

Security Becomes Much Bigger Issue For AI/ML Chips, Tools

Chip Industry’s Technical Paper Roundup: Jan 3

Multi-Wavelength, Multimode Communication Scheme For On-Chip and Chip-to-Chip Interconnects

Week In Review: Semiconductor Manufacturing, Test

Week In Review: Semiconductor Manufacturing, Test

Technical Paper Roundup: Sept 27

More Efficient On-Chip Laser Frequency Comb (Harvard)

Academic Research Paper Round-Up: April 13

Electrically pumped laser transmitter integrated on thin-film lithium niobate

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