Micro-Transfer Printing (MTP) As A Promising Scalable Approach to Heterogeneous Integration for Silicon Photonics (Ghent U., imec et al)


A new technical paper, "Micro-Transfer Printing on Silicon Photonics: Tutorial, Recent Progress and Outlook," was published by researchers at Ghent University, imec et al. Abstract "This paper highlights micro-transfer printing (MTP) as a promising scalable approach to heterogeneous integration for silicon photonics. MTP uniquely achieves high integration density, high throughput, and hig... » read more

Fabrication Of Vertical-Taper Structures For Silicon Photonic Devices By Using Local-Thickness-Thinning Process


Authors: Shunsuke Abe, Hideo Hara, Shin Masuda, and Hirohito Yamada. This paper describes a simple fabrication process of verticaltaper structures which can locally tune the thickness of silicon photonic devices. For low-loss spot-size conversion, taper angles less than 10° are required. To fabricate the gradual-slope shape of the vertical tapers, we have developed a step-andexposure lithog... » read more

Multi-Wavelength, Multimode Communication Scheme For On-Chip and Chip-to-Chip Interconnects


A technical paper titled "Multi-dimensional data transmission using inverse-designed silicon photonics and microcombs" was published by researchers at Stanford, Harvard, University of Central Florida, NIST, and others. "Here we demonstrate an integrated multi-dimensional communication scheme that combines wavelength- and mode- multiplexing on a silicon photonic circuit. Using foundry-compati... » read more