Securing physical AI; agents need feedback; 3D-IC security; chiplet interoperability; RF digital twins.
Synopsys’ Dana Neustadter and Ilya Tolchinsky warn that physical AI creates a different kind of security challenge that requires continuous runtime assurance to ensure outputs remain within safe operating bounds as conditions change.
Cadence’s Hamid Shojaei argues that building a reliable agent for chip design relies on closing the loop, where the agent proposes something, a tool gives it real high-quality feedback, the agent reasons over that feedback and refines, and you repeat until you converge.
In a podcast, Siemens’ Tova Levy chats with Chris Jones of Crypto Quantique about what it takes to build hardware security into silicon from the ground up and why the move to 3D-IC architectures is making that challenge dramatically harder.
Arm’s Francisco Socal explains how the property negotiation mechanism in AMBA CHI C2C enables interoperability and complexity scaling to allow chiplets with different degrees of features and capabilities to connect.
Keysight’s Richard Duvall explains why simulation must move closer to predictive validation with RF digital twins as wireless systems become more tightly coupled across RF, antenna, baseband, and channel domains.
The ESD Alliance’s Julie Rogers chats with John Barr of Needham about his investment decision process and how his background in EDA was key to developing it.
Plus, check out the blogs featured in the latest Manufacturing, Packaging & Materials newsletter:
Amkor’s Dambi Jo and colleagues demonstrate how they characterize the properties of thermal interface materials under actual application conditions.
Synopsys’ Saurabh Suryavanshi shows how physics-grounded workflows help process teams explore, understand, and act on a rapidly expanding innovation space.
Lam Research’s Assawer Soussou explains how backside power delivery networks maintain power and performance while reducing area.
SEMI’s Mark da Silva and Anshu Bahadur, in conjunction with Micron and ULVAC, point to an environmentally friendly Industry 4.0 technology roadmap.
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