Chip Industry Week in Review


The IEEE ISSCC conference was held this week in San Francisco. Among the highlights: IBM detailed an AI accelerator based on its new inferencing dataflow architecture. CEA-Leti presented a chip-scale, ultra-fast, battery-operated EPR spectrometer. QuTech introduced a cryo-CMOS SoC with NV centers in diamond. UTokyo showed its low-jitter PLL architecture for beyond 5G/6G. Imec d... » read more

Chip Industry Week in Review


SK hynix is ramping HBM manufacturing capacity to meet explosive demand for AI data centers. The company will launch 16-stack HBM4 next year, and up to 12-stack HBM4E. HBM5 and HBM5E will be introduced between 2029 and 2031, reports Business Korea. China will not have access to NVIDIA’s most advanced chips, President Trump told 60 Minutes. The Dutch economy minister said Nexperia's chip... » read more