Chip Industry Technical Paper Roundup: May 5


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Rethinking Compute Substrates for 3D-Stacked Near-Memory LLM Decoding: Microarchitecture-Scheduling Co-Design 🔗 Univ. of Edinburgh, Peking Univ., Cambridge, CAS, HKUST In-SoIC ESD Protection for Chiplet-Based 3D Microsystems: Future Research Direct... » read more

Microarchitecture Tailored to 3D-Stacked Near-Memory Processing LLM Decoding (U. of Edinburgh, Peking U., Cambridge et al.)


A new technical paper, "Rethinking Compute Substrates for 3D-Stacked Near-Memory LLM Decoding: Microarchitecture-Scheduling Co-Design," was published by researchers at University of Edinburgh, Peking University, University of Cambridge, University of Chinese Academy of Sciences, and the Hong Kong University of Science and Technology. Abstract "Large language model (LLM) decoding is a majo... » read more

Chip Industry Technical Paper Roundup: Mar. 3


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations AutoGNN: End-to-End Hardware-Driven Graph Preprocessing for Enhanced GNN Performance 🔗 KAIST, Panmnesia, Peking University, Hanyang University, Pennsylvania State University Sputtering-driven formation of interstitial oxygen for intrinsic NIR detec... » read more

An FPGA-based Accelerator Addressing Bottlenecks in GNN Preprocessing (KAIST et al.)


A new technical paper "AutoGNN: End-to-End Hardware-Driven Graph Preprocessing for Enhanced GNN Performance" was published by researchers at KAIST, Panmnesia, Peking University, Hanyang University, and Pennsylvania State University. Abstract "Graph neural network (GNN) inference faces significant bottlenecks in preprocessing, which often dominate overall inference latency. We introduce Au... » read more

Research Bits: Jan. 27


Analog in-memory compute Researchers from Politecnico di Milano, Peking University, and Hewlett Packard Labs developed a Closed-Loop In-Memory Computing (CL-IMC) chip to reduce data movement between memory and processor. The fully integrated analog accelerator uses two 64×64 arrays of programmable SRAM cells along with integrated components including operational amplifiers and analog-to-di... » read more

Chip Industry Technical Paper Roundup: Jan. 27


New technical papers recently added to Semiconductor Engineering’s library: [table id=517 /] Find more semiconductor research papers here. » read more

Co-optimization Approaches For Reliable and Efficient AI Acceleration (Peking University et al.)


A new technical paper titled "The Quest for Reliable AI Accelerators: Cross-Layer Evaluation and Design Optimization" was published by researchers at Peking University and Beijing Advanced Innovation Center for Integrated Circuits. Abstract "As the CMOS technology pushes to the nanoscale, aging effects and process variations have become increasingly pronounced, posing significant reliabilit... » read more

Chip Industry Week in Review


Samsung and SK hynix joined OpenAI's Stargate initiative to ensure there will be enough memory chips to meet the needs of AI data centers. The goal is to produce up to 900,000 DRAM wafer starts per month. OpenAI also inked agreements to explore the development of next-gen data centers in Korea. Axcelis Technologies (ion implantation systems) will merge with Veeco Instruments (compound semic... » read more

Chip Industry Technical Paper Roundup: August 26


New technical papers recently added to Semiconductor Engineering’s library: [table id=467 /] Find more semiconductor research papers here. » read more

Reconfigurable Single-Walled CNT FeFET (Univ. of Pennsylvania, Yonsei et al.)


A new technical paper titled "Reconfigurable single-walled carbon nanotube ferroelectric field-effect transistors" was published by researchers at University of Pennsylvania, Yonsei University, Kookmin University, SKKU and Peking University. Abstract "Reconfigurable devices have garnered significant attention for alleviating the scaling requirements of conventional complementary metal-oxide... » read more

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