tag: IBM

FD-SOI Going Mainstream
By Ed Sperling - 19 Jul, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss changes in the FD-SOI world and what's behind them, with James Lamb, deputy CTO for advanced semiconductor manufacturing and corporate technical fellow at Brewer Science; Giorgio Cesana, director of technical marketing at STMicroelectronics; Olivier Vatel, senior vice president and CTO at Screen Semiconductor Solutions; and Carlos Mazure, CTO at Soi... » read more

Five DAC Keynotes
By Brian Bailey - 17 Jul, 2018 - Comments: 0

The ending of Moore's Law may be about to create a new golden age for design, especially one fueled by artificial intelligence and machine learning. But design will become task-, application- and domain-specific, and will require that we think about the lifecycle of the products in a different way. In the future, we also will have to design for augmentation of experience, not just automation... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 13 Jul, 2018 - Comments: 0

Deals ArterisIP inked a deal with Mobileye, which has bought multiple licenses for ArterisIP's interconnect and resilience technology for functional safety and AI hardware acceleration. Mobileye, which was purchased by Intel last year for $15.3 billion, will use the technology for ISO 26262/ASIL B and D SoCs. Siemens agreed to operate its MindSphere digital operating system on Alibaba Cloud... » read more

Security Holes In Machine Learning And AI
By Ed Sperling - 09 Jul, 2018 - Comments: 0

Machine learning and AI developers are starting to examine the integrity of training data, which in some cases will be used to train millions or even billions of devices. But this is the beginning of what will become a mammoth effort, because today no one is quite sure how that training data can be corrupted, or what to do about it if it is corrupted. Machine learning, deep learning and arti... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 06 Jul, 2018 - Comments: 1

Deals SoftBank Corp. reached an agreement with Indonesia’s Link Net to work together on Internet of Things technology. Hidebumi Kitahara of SoftBank said in a statement, “The global mobile industry is now entering the 5G era, with IoT becoming the central focal point of innovation. This partnership with Link Net shows our strong commitment to further boost technology innovation in the glob... » read more

Week in Review: IoT, Auto, Security
By Jeff Dorsch - 29 Jun, 2018 - Comments: 0

Executive Changes Rambus' board of directors named Luc Seraphin, senior vice president and general manager of the company's Memory and Interfaces Division, as interim CEO while it searches for a replacement for Ron Black. The board terminated Black this week, saying the reason for termination did not involve Rambus' financial and business performance. The company also named Mike Noonen as se... » read more

Week In Review: Design, Low Power
By Jesse Allen - 29 Jun, 2018 - Comments: 0

M&A Siemens acquired Austemper Design Systems, which provides tools for functional safety and safety-critical designs. Founded in 2015, Texas-based Austemper adds state-of-the-art safety analysis, auto-correction and fault simulation technology to address random hardware faults, as well as correct and harden vulnerable areas, subsequently performing fault simulation to ensure the design is... » read more

The Week in Review: IoT
By Jeff Dorsch - 22 Jun, 2018 - Comments: 0

Finance Marvell Technology Group priced $500 million in senior notes due in 2023 and $500 million in senior notes due in 2028. The chip company will use net proceeds from the debt offering, cash on hand, and borrowings under a new term loan facility to fund the cash consideration and other amounts payable for Marvell’s proposed $6 billion acquisition of Cavium. The companies have expected to... » read more

Quantum Computing Becoming Real
By Ed Sperling - 21 Jun, 2018 - Comments: 4

Quantum computing will begin rolling out in increasingly useful ways over the next few years, setting the stage for what ultimately could lead to a shakeup in high-performance computing and eventually in the cloud. Quantum computing has long been viewed as some futuristic research project with possible commercial applications. It typically needs to run at temperatures close to absolute zero,... » read more

Dealing With Resistance In Chips
By Mark LaPedus - 21 Jun, 2018 - Comments: 2

Chipmakers continue to scale the transistor at advanced nodes, but they are struggling to maintain the same pace with the other two critical parts of the device—the contacts and interconnects. That’s beginning to change, however. In fact, at 10nm/7nm, chipmakers are introducing new topologies and materials such as cobalt, which promises to boost the performance and reduce unwanted resist... » read more

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