tag: IBM

What China Is Planning
By Mark LaPedus - 21 Oct, 2015 - Comments: 1

Over the years, China has unveiled several initiatives to advance its domestic semiconductor industry. China has made some progress at each turn, although every plan has fallen short of expectations. But now, the nation is embarking on several new and bold initiatives that could alter the IC landscape. China’s new initiatives address at least three key challenges for its IC industry: 1. C... » read more

Manufacturing Of Next-Generation Channel Materials
By Michael Watts - 05 Oct, 2015 - Comments: 0

One of the many challenges for the IC developers is to change the channel material to increase transistor mobility. But what about manufacturing? Can LED-style epitaxy be migrated to high-volume silicon manufacturing? “The use of Ge and InGaAs quantum wells is an extension of the current strained Si strategy," said Aaron Thean, vice president of process technologies and director of the log... » read more

Is The 2.5D Supply Chain Ready?
By Ed Sperling - 28 Sep, 2015 - Comments: 0

A handful of big semiconductor companies began taking the wraps off 2.5D and fan-out packaging plans in the past couple of weeks, setting the stage for the first major shift away from Moore's Law in 50 years. Those moves coincide with reports of commercial [getkc id="82" kc_name="2.5D"] chips from chip assemblers and foundries that are now under development. There have been indications for... » read more

Pick A Number
By Ed Sperling - 24 Sep, 2015 - Comments: 0

For the past two years there was some mumbling that 16/14nm would be short-lived, and that 10nm would be the place that foundries would invest heavily. Now the buzz is that 10nm may be skipped entirely and the next node will be 7nm. After all, 10nm is really only a half-node. Or is it? The answer depends on who's defining 10nm. The 16/14nm node is based on a 20nm back-end-of-line process, un... » read more

New Metrics For The Cloud
By Ed Sperling - 10 Sep, 2015 - Comments: 0

Data centers are beginning to adjust their definition of what makes one server better than another. Rather than comparing benchmarked performance of general-purpose servers, they are adding a new level of granularity based upon what kind of chips work best for certain operations or applications. Those decisions increasingly include everything from the level of redundancy in compute operations, ... » read more

Making Hardware Design More Agile
By Ed Sperling - 31 Aug, 2015 - Comments: 1

Semiconductor engineering sat down to whether changes are needed in hardware design methodology, with Philip Gutierrez, ASIC/FPGA design manager in [getentity id="22306" comment="IBM"]'s FlashSystems Storage Group; Dennis Brophy, director of strategic business development at [getentity id="22017" e_name="Mentor Graphics"]; Frank Schirrmeister, group director for product marketing of the System ... » read more

What Is ‘Digital’?
By Brian Bailey - 27 Aug, 2015 - Comments: 1

I saw a LinkedIn article with this title a couple of weeks ago and was curious. Do we not know what digital is and do we need to question it? When I read the first line I was very surprised and somewhat confused. Ved Sen, the author said that, “Despite working in the digital space for years, now I was quite stumped a few weeks ago when I was asked to define it.” Why would digital be so d... » read more

2.5D Creeps Into SoC Designs
By Ed Sperling - 13 Aug, 2015 - Comments: 0

A decade ago top chipmakers predicted that the next frontier for SoC architectures would be the z axis, adding a third dimension to improve throughput and performance, reduce congestion around memories, and reduce the amount of energy needed to drive signals. The obvious market for this was applications processors for mobile devices, and the first companies to jump on the stacked die bandwag... » read more

Making Hardware Design More Agile
By Ed Sperling - 12 Aug, 2015 - Comments: 1

Semiconductor engineering sat down to whether changes are needed in hardware design methodology, with Philip Gutierrez, ASIC/FPGA design manager in [getentity id="22306" comment="IBM"]'s FlashSystems Storage Group; Dennis Brophy, director of strategic business development at [getentity id="22017" e_name="Mentor Graphics"]; Frank Schirrmeister, group director for product marketing of the System ... » read more

Multiple Lithography Options Still Remain in Play
By Paula Doe - 03 Aug, 2015 - Comments: 1

The throughput and uptime of EUV, and the overlay accuracy of 193nm immersion lithography, continue to steadily improve, though neither is yet ready for 10nm production, according to speakers at SEMICON West. Mike Lercel, ASML director, Product Marketing, reported several EUV tool sites achieved 70 percent uptime for more than a week, and one customer site had done so for more than four ... » read more

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